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Numerical Analysis of the Bifurcation Problem of Nano-scale Thin Metal Film Under Tension

Author: ZhangShiJie
Tutor: WangShiBin
School: Tianjin University
Course: Solid Mechanics
Keywords: Nanofilm Bifurcation Fracture Deform Necking Perturbation analysis
CLC: O484.2
Type: Master's thesis
Year: 2010
Downloads: 21
Quote: 0
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Abstract


The numerical analysis is carried on the the metal nanofilm stretch bifurcation problem. First study the long-wave disturbances under separate metal films significantly inhomogeneous deformation, and compared with the linear perturbation analysis results in the long-wave disturbances; dramatically uneven deformation of the metal film on polymer substrate numerical analysis, and compared with linear perturbation analysis results; numerical simulation results of these two sets of separate metal film and metal film glued to the polymer substrate, substrate inhibition of the metal film substantially inhomogeneous deformation. Of elasticity and the thickness of the substrate and the film of the substrate than the deformation of the nano-metal thin film has an important influence. In order to study the influence of these two factors on the deformation, according to the different ratios of the substrate and film thickness, the design and three groups of calculation, and do a comparison between these three groups, and each group calculated, based on elastic modulus of the substrate, the amount divided into three cases, the contrast in the middle of these three cases. Obtained in the calculation process, the the three deformation mode of the composite structure of the film substrate. When a relatively large substrate flexible, the film is formed in the gap at a necked base and therefore in the vicinity of the film-necked local distortions. Just as linear perturbation analysis and forecast, as the flexible large base does not inhibit the strain within the metal film. When the elasticity of the substrate in the middle state, the metal film forming a plurality of necking, and to withstand large tensile strain, and then in the notch at the fracture. When the substrate relatively large rigidity, the metal thin film can be in a great strain range uniform deformation without fracture. Substrate Young's modulus of the same case, the substrate is thicker the critical bifurcated strain of the composite structure of the film substrate, the greater. In order to study the film substrate interface adhesion properties of tensile properties of composite structures, cohesive unit in ABAQUS simulation of the film-substrate interface. In the two dimensionless parameters to describe the strength of the interface. Calculated that the adhesion properties of the interface, the tensile properties of the film base structure is not the same, the calculation results obtained three deformation mode. And further study of the interface opening displacement and sliding displacement of the metal film necking and interface strength to strength and cut fracture strain. Calculated that the fracture strain of the metal thin film on the interface shear strength is more sensitive.

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CLC: > Mathematical sciences and chemical > Physics > Solid State Physics > Thin Film Physics > Mechanical effects in the film
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