About 34 item dissertation in line with drop test query results,the following is 1 to 50(Search took 0.020 seconds)

  1. Parameters Identification of School Bus by Experimental Modal Analysis and Simulation Research,ZhangYinChao/Hunan University,0/6
  2. Research on the Key Technologies of Safety Design for Spent Fuel Transportation Cask,XuChao/Zhejiang University,0/78
  3. The Reliability Modeling and Simulation on Power Module Based on Embedded System Package,GuJiangHai/Zhejiang University of Technology,0/39
  4. Numerical Study on Impact Failure of Electronic Packaging Component,JinChaoChao/Zhejiang University of Technology,0/57
  5. Research on reliability of wafer level packaging board level drop,YeXiaoTong/Fudan University,0/88
  6. Thermal design and reliability analysis of POP,QiuXiang/Fudan University,0/118
  7. The Reliability Effect of Interface Reaction with Finishes and SnAgCu on the Solder Joint,ZhouPeng/Guilin University of Electronic Science and Technology,0/34
  8. A Passenger Car’s Driver Airbag Protection Optimization and Method Research,WangXianWei/Jilin University,0/40
  9. Technology Research of an Aircraft Landing Gear Drop Test,AnHongHui/Nanjing University of Aeronautics and Astronautics,0/165
  10. Damage Analysis of Composite Overwrapped Pressure Vessels under Low Velocity Impact,YangLiuZuo/Dalian University of Technology,0/113
  11. The Electrochemicalmigration Study of Silver Plate on Immersion Silver PCB,YangPan/Beijing University of Posts and Telecommunications,0/9
  12. Research on Dissipating Mechanism and Design of the Elastomer Absorber,JiaJiuHong/Shanghai Jiaotong University,2/294
  13. Undercarriage buffer system characteristics and semi- active control technology,LiuZuo/Nanjing University of Aeronautics and Astronautics,3/487
  14. Research on the Computer Aid Testing System of Dropping Test-bed,LiZhiHua/Wuhan University of Technology,0/96
  15. Half Sine Wave Shock-exited Analysis Based on ASQ700 Model,FengGuoHua/Suzhou University,4/161
  16. Research on Simulation Application for TV Drop Experiment,ShaoXiaoJun/Qingdao University,1/162
  17. Semi- active control of the application of the technology in the landing gear in the buffer system,LiuZuo/Nanjing University of Aeronautics and Astronautics,7/190
  18. Study on Relaxation Effect of Vertical Soil Pressure for Shield Tunnel,JiaRui/Hohai University,5/416
  19. Drop-impact Simulation of PCB Assembly Using Finite Element Method,LuWeiSheng/Suzhou University,3/419
  20. A Study on Impact of Composite Material CNG Cylinder,ZhangZhen/North China University of,1/278
  21. The Testing Study of Temperature Limit and Pressure Drop for Oil-gas-water Mixed Transportation during Extracting Oil of Highly-Watery,GuoJingHong/Daqing Petroleum Institute,2/208
  22. The Test and the Dynamic Simulation of New-style Hydraulic-gap Buffer,LiMingYue/Dalian University of Technology,6/242
  23. Research on Molded Paper Pulp Cushion Property of LCD TV and Virtual Simulation for Package,XuJiaJia/Jiangnan University,0/144
  24. Drop/Impact Analysis Based on the Numerical Model,ZhangWeiGuo/Jiangnan University,3/165
  25. Research on Overload Characteristics of Initiating Device by Falling Ball Collision Simulation Tests,HeXiaoBin/Nanjing University of Technology and Engineering,1/82
  26. The Research on Drop Test of Mobile Telephone and Its’ CAE Technology,DuanLiang/Shandong University,4/276
  27. The Reliability Study and Package Improvement for Fused Biconical Taper Couplers,LiuXiaoLi/Dalian University of Technology,0/55
  28. Study on Reliability of Flash Memory in Handhold Device Through Drop Test Analysis,DingXingShun/Suzhou University,0/19
  29. Conceptual Design of Landing Gear for Heavy Load Aircraft,ZhengLan/Nanjing University of Aeronautics and Astronautics,2/115
  30. Solder joint reliability problems unleaded stacked CSP package drop test,SunGuoYing/Fudan University,0/32
  31. Structral Design and Test on Molded Pulp Packaging of Notebook,HeYanPing/Xi'an University of Technology,0/176
  32. The Modeling and Simulation for Solder Joint Reliability of Microelectronic IC Package by Substructure Method,LiuFei/Zhejiang University of Technology,0/91
  33. To sudden expansion Down Floor stream eliminate hydraulic characteristics of,WangLiHui/Kunming University of Science and Technology,0/34
  34. TSV interconnect technology Reliability,HouZuo/Fudan University,1/412

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