About 101 item dissertation in line with electronic packaging query results,the following is 1 to 50(Search took 0.063 seconds)

  1. Study on Preparation and Properties of Polysiloxane Modified Epoxy Encapsulating Material,ZhaoShuang/Harbin University of Science and Technology,0/37
  2. Development of Special Flux Matching Sn-Zn Lead-free Solder for Electronic Packaging,HanRuoNan/Nanjing University of Aeronautics and Astronautics,0/17
  3. The Study on Preparation and Microstructure Properties of Low Expansion Al-Si Matrix Composites,ZhangLiJun/Henan University of Science and Technology,0/9
  4. Study on Fabrication and Properties of Diamond/Al Matrix Composites Used in Electronic Packaging,LiXin/Chengdu University of Technology,0/50
  5. Wire Bonding Copper Ball Heating Device and Experimental Research,ZhangHeng/Guangdong University of Technology,0/20
  6. Study on Reverse Polarity Effect in Sn-9Zn Interconnect during Liquid-solid Electromigration,ZhouQiang/Dalian University of Technology,0/26
  7. Study of Electromigration in Lead-free Solder Joints on Electroless Ni-P Substrate,ZhouShaoMing/Dalian University of Technology,1/66
  8. Pressureless Infiltration Process Optimization and Stereotypes for β-SiC_p/Al Applied to Electronic Packaging,RenHuaiYan/Xi'an University of Science and Technology,0/70
  9. Pressureless Infiltration Prepare for SiC/Al Electronic Packaging Materials,HeQingShan/Shandong University,0/223
  10. Study on Microstructure and Properties of Spray Deposition Si-Al Alloys,LiHao/Jiangsu University of Science and Technology,0/143
  11. Development and Application of Sn-Zn Based Hypoeutectic Solders for Soldering in Electronic Packaging,HuangJiaQiang/South China University of Technology,0/7
  12. Research and Development of a Soldering Flux for Lead-free Solder Wires in Al Soldering Process of Electronic Packaging,WangChao/South China University of Technology,0/13
  13. Research of Low Temperature Bongding Technology Based on Micro-Cones Arrays,XuPo/Shanghai Jiaotong University,0/46
  14. The Study of Dielectric and Thermal Properties of Hollow Glass Microsphere and Nitride Filled Polymer Composites,MaJing/Wuhan University of Science and Technology,0/102
  15. Study on Fabrication and Properties of Silicon Carbide Particle Reinforced Aluminum Matrix Composites,HuangSiDe/Hefei University of Technology,0/436
  16. Rearch of Green Environmental Protection Hemp Fiber Reinforced Thermosetting Resins Electronic Packaging Material,WangQiong/Xi'an University of Engineering,0/17
  17. High Performance Epoxy Resin Using in Electronic Package Material: Synthesis and Properties Studies,LiuZhongGuo/Jilin University,0/393
  18. Wetting Dynamics of Solders in SMT,LiSong/Huazhong University of Science and Technology,2/825
  19. New lightweight low-expansion study of the high thermal conductivity electronic packaging materials,YangFuLiang/Central South University,3/1012
  20. Study on Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in Microelectronic Packaging,ZhouJun/Zhejiang University of Technology,3/575
  21. Preparation of SiCp/Al Composites and Electronic Device Fabrication,GuXiaoFeng/Wuhan University of Technology,6/613
  22. Transient Contact Liquid-Solid Reaction of Solder Droplet/Pad and Interfacial Microstructure Evolution,LiFuQuan/Harbin Institute of Technology,2/395
  23. High Temperature Moire Interferometry Technique and Its Applications,ZouDaQing/Tsinghua University,4/129
  24. Studies on a Multifunctional Macro/Micro Moire Interferometer Measurement System and Its Applications,LiuJie/Tsinghua University,1/132
  25. Development of Lead Free Solder and Its Interfacial Issues in Electronics Packaging,YuDaQuan/Dalian University of Technology,32/1471
  26. Reliability Research on Electronic Packaging,CaiXia/Shanghai Institute of Microsystem and Information Technology Research Institute,11/976
  27. Reliability Research on Electronic Packaging,XuBuLu/Shanghai Institute of Microsystem and Information Technology Research Institute,17/1803
  28. High temperature reliability study of lead-free solder surface mount solder joints,XiaoKeLaiTi/Shanghai Institute of Metallurgy , Chinese Academy of Sciences,13/565
  29. 1.Molecular Dynamics Simulation for the Vibration Characteristics of Nonlinear Optical Material BBO 2.Reliability Research on Flip Chip Electronic Packaging,ChenLiu/Shanghai Institute of Metallurgy , Chinese Academy of Sciences,1/361
  30. Study on the Reliability of SMT Solder Joint in Electronic Packaging,ZhuQiNong/Shanghai Institute of Metallurgy , Chinese Academy of Sciences,21/1218
  31. Study on Conducting Polypyrrole Films for Electromagnetic Interference Shielding,ShenLaZhen/Tianjin University,2/431
  32. The Study of the Chip Reliabilty about the Failure of Packaging Epoxy Molding Compound,ChenTong/Taiyuan University of Technology,0/221
  33. Study on the Nickel Micro-nanocones Array Materials Fabricated by Electrodeposition,Hang/Shanghai Jiaotong University,1/246
  34. Study on Synthesis and Performances and of Epoxy Resin Materaials Used in Elexctronic Packaging,LiShiWei/Jilin University,3/1207
  35. Elasto-Plastic Analysis of Popcorn Failure Caused by Cavitition Unstable Growth in Plastic IC Packaging Material,LiZhiGang/Taiyuan University of Technology,0/71
  36. Fabrication and Properties of β-SiCp/Al Electronic Packaging Material by Pressureless Infiltration,LiuZuoZuo/Xi'an University of Science and Technology,3/189
  37. Study on the Preparation and Properties of Electronic Packaging Material ZrW2O8/E-51 with Lower Linear Expansion Coefficient,XuWei/Jiangsu University,0/192
  38. Study on Preparation and Properties of Cu/ZrW2O8 Composites,WangChunSheng/Jiangsu University,0/120
  39. Dynamic Bending Experiment and Numerical Study of Board Level Electronics Package,JinLing/Beijing University of Technology,1/121
  40. Study on the Dynamic Weighing System and Data Processing Methods of Electronic Quantitative Packaging Machine,LuoJiaJia/Xiamen University,5/381
  41. Electronic packaging SiCp / Al composites thermal conductivity,ZouAiHua/Nanchang Institute of Aeronautical,1/316
  42. Morphology of Lead-free SnAgCu Solder Wetting on Cu with Artifical Non-wetting Zone,WangFuXue/Dalian Jiaotong University,0/209
  43. Lead-free solder for electronic packaging chips Influence of Dynamic Reliability,YuanGuoZheng/Taiyuan University of Technology,2/301
  44. Design and Thermal Analysis of Bonding System Used for RFID Tag Packaging,Zheng/Huazhong University of Science and Technology,2/257
  45. The Preliminary Study of a New Lead-free Interconnection Method Based on Electromagnetic Stirring,HuYanXiang/Huazhong University of Science and Technology,0/67
  46. Prepared by powder metallurgy new Si-Al Electronic Packaging Materials,CaiYang/Central South University,2/368
  47. IC chip package thermal - structural analysis and optimization of numerical simulation,JinYongXin/Dalian University of Technology,4/585
  48. Study on Thermodynamics Behavior of SMT Solder Joints,NieXiaoLong/Beijing University of Technology,4/264
  49. Research on the Thermal Deformation and Stress of Metal Package with Low Resistance Leads,BaiRui/Tsinghua University,3/208
  50. Aluminum infiltration of silicon carbide electronic packaging materials thermo-physical properties,WangTao/Northwestern Polytechnical University,5/358

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