Dissertation > Excellent graduate degree dissertation topics show

Design and Thermal Analysis of Bonding System Used for RFID Tag Packaging

Author: Zheng
Tutor: DingHan；YinZhouPing
School: Huazhong University of Science and Technology
Course: Mechanical Manufacturing and Automation
Keywords: Electronic Packaging Radio Frequency Identification Anisotropic Conductive Adhesive Hot curing Temperature control Thermal analysis
CLC: TP391.44
Type: Master's thesis
Year: 2006
Downloads: 257
Quote: 2
Read: Download Dissertation

Abstract


Electronic packaging technology and related equipment plays a vital role in the quality , volume and cost of electronic products . Anisotropic conductive adhesive interconnect packaging process , design a cure for RFID ( radio frequency identification ) tag manufacturing system , the key components of the system and RFID tags and curing curing process heat . This paper studies the flip-chip technology , the three conductive adhesive interconnect process : isotropic conductive adhesive , anisotropic conductive adhesive and non - conductive plastic . Combining the characteristics of the RFID tag-manufacturing , analysis of the advantages and disadvantages of the three processes in the practical application . By comparison , the anisotropic conductive adhesive interconnection process as an RFID tag manufacturing . Complete RFID tag manufacturing equipment and process requirements of the anisotropic conductive adhesive , designed the the hot curing the mechanical structure of the system and its workflow . According to the process parameters of the anisotropic conductive adhesive designed temperature controlled micro adjustable force hot head, head has a simple structure , low cost and easy removal of the hot press . Temperature accuracy requirements for anisotropic conductive adhesive designed PID temperature control system based on single chip structure , combined with the use of the environment of the thermal head temperature control error compensation method . Application lumped parameter thermal head, the steady-state and dynamic equivalent electrical model , and the thermal head is steady-state and dynamic thermal analysis , and analysis of the heating core temperature fluctuations on the face temperature . The application of ANSYS WorkBench finite element analysis software on the thermal head is a steady-state thermal analysis , combined with the experimental data with the lumped parameter method of calculation results were compared to prove the effectiveness of the two types of thermal analysis methods . This article established the the RFID chip interconnect process of thermal model , anisotropic conductive adhesive colloidal applications Flotherm thermal analysis software of electronic products in different heating methods and process parameters on the temperature response . According to the results of the simulation analysis discussed several key issues to improve the efficiency of anisotropic conductive adhesive curing , improve the production performance of the cured system .

Related Dissertations

  1. Simulation Analysis on Temperature Stress of RCC Arch Dam and Its Construction Joints Design Research,TV642.2
  2. Transient Thermal Analysis of Multi-Body System with Complicated Boundary Conditions,TK124
  3. Design and Simulation of UHF RFID System Based on the Protocol of EPC C1G2,TP391.44
  4. The Development of Electric Control System for Product Line of Cross-Linked Cable,TP273.5
  5. Research on Temperature Control System for Laser Diode,TP273
  6. Research on Temperature Control System for High-Performance Oven-Control Crystal Oscillator (OCXO),TN752
  7. Animal products quality safety and security regulation of RFID systems,TS201.6
  8. Studies on the Techniques of Multi-season Cultivation for Nanling Mushroom,S646.11
  9. Multilayer coextrusion drooling forming process temperature control technology,TQ320.721
  10. Oil sludge production and use of coal- water slurry experimental study,TQ536
  11. Medium Density Fiberboard Drying System and PLC Control System Design,TP273
  12. Simulation Research on Hydraulic System of Extra-High Pressure Water Jet Equipment,TH137
  13. The Design and Implementation of Control System for Wire-steel Heat Treatment Direct-fired Furnace,TP273
  14. Research on the Low-cost RFID Systems Security Protocol,TP391.44
  15. The Research and Design of Pressure Cooker System Based on Fuzzy Neural Network,TM925.5
  16. Experimental Research to Control the Temperature of Arc Discharge Plasma Used to Produce NO,TM832
  17. The Research and Design of Radio Frequency Monolithic Voltage Controlled Oscillator in 0.18μm CMOS Technology,TN752
  18. The Design and Implementation of Management and Control System of RFID Code Resolution Networks,TN915.0
  19. RFID Authentication Protocol Based on Hash Function,TP391.44
  20. Research of the Security Authentication Protocol for RFID Systems,TP391.44
  21. RFID data cleaning treatment strategies and algorithms,TP391.44

CLC: > Industrial Technology > Automation technology,computer technology > Computing technology,computer technology > Computer applications > Information processing (information processing) > Pattern Recognition and devices > Optical pattern recognition devices
© 2012 www.DissertationTopic.Net  Mobile