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The Coupling and Package Research of Planar Lightwave Circuit with Fiber Array

Author: WangMingJie
Tutor: YangJian
School: Dalian University of Technology
Course: Microelectronics and Solid State Electronics
Keywords: Splitter Chip Fiber Array Coupling Efficiency Inclined Surface
CLC: TN253
Type: Master's thesis
Year: 2013
Downloads: 43
Quote: 0
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Abstract


With the advent of the information age, the application of fiber optic and its related devices as an information transmission medium has been very extensive, planar lightwave circuit splitter because of its superior performance has been the preferred device in information demultiplexing.The planar waveguide is spliced with fiber array and PLC chip. So fiber array, PLC chip and precise coupling docking jointly determine the ultimate performance of the device. The main contents are described as follows:(1) All the components of the fiber array are introduced, the calculation method of the parameters of the V-groove is given and the production process is introduced. The reason why optical adhesive is widely used in the bonding of fiber array is given by comparing the three bonding methods. Finally, the factors that affect the quality of fiber array are analyzed.(2) A brief introduction to the spectral principle of the PLC chip is provided. The mathematical expression of Y-branch is provided, which provide convenience for the graphic design of the chip. Finally, flame hydrolysis method, the basic production process of PLC chip, is provided.(3) Firstly, the existing coupling theory of optical fiber is analyzed, that is without taking into account the tilt angle of inclined surface. A new way of computing is provided, based on the existing coupling theory, which is closer to the practice. And this way takes into account the tilt angle of inclined surface. Based on the new way of computing, the coupling efficiency is calculated as the FA and the PLC chip are separated in longitudinal direction and are offset or have different tilt angle of inclined surface. The calculation results are analyzed. The coupling efficiency between FA and PLC chip, the tilt angles of inclined surface are equal to8degrees, is obtained by experimental measurement. It was proved that the theoretical calculation result is reliability and accuracy by comparing the results of theoretical calculation and experimental data. And some improvement advice for productive technology is provided.(4)The PLC package systems and processes are introduced, and the relationship between the device insertion loss and the PLC splitter dedicated box is studied.

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Photonics technology,laser technology > Optical waveguide and integrated optics > Fiber optic components
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