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Preparation and Microstructure and Properties of (SIC_P +Cu)/Al Electronic Packaging Composites

Author: ChengYu
Tutor: ZhengZhenZuo
School: Harbin Institute of Technology
Course: Materials Engineering
Keywords: Electronic packaging materials Powder Metallurgy Aluminum matrix composites Hot extrusion Thermophysical properties
CLC: TB331
Type: Master's thesis
Year: 2011
Downloads: 60
Quote: 0
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Abstract

This article was prepared by hot extrusion method using cold isostatic pre suppress the SiC mass fraction of 30%, mass fraction of Cu respectively 5%, 8%, 10% of the aluminum of electronic packaging materials. Use of X-ray diffraction analysis instrument, transmission electron microscopy, scanning electric mirrors, electronic tensile test machine, thermal conductivity tester, thermal expansion of the test instrument equipment on the (SiC of Cu) / Al composite materials of the structure and mechanical performance and thermal performance were observation and testing. Of cold material after HIP at 300 ℃ first pre-pressed to increase density. After its hot extrusion at 400 ° C and 450 ℃. The results showed that the the dense composite tissue; enhanced body evenly distributed, with no segregation. 450 ℃ hot extruded composite Cu and Al completely react generation CuAl2 Cu remaining 400 ° C after extrusion composite extrusion temperature on the reaction between Cu and Al greater impact. 400 ℃ and 450 ℃ extruded composite mechanical properties testing and analysis. Experimental results The results show that regardless 400 ℃ or 450 ℃ after extrusion composites, tensile strength and elastic modulus increases with increasing Cu content, which is related to the in situ reaction of Cu and Al. 400 ° C after extrusion the tensile strength of the composite material is higher than 450 ° C after extrusion composite materials, but for higher modulus of elasticity, after extrusion of the 450 ℃. Electronic packaging materials is extremely important thermophysical properties testing and analysis. The test results show that the thermal conductivity of the composites at 450 ℃ and 400 ℃ extruded with increasing Cu content increases, and 400 ° C after extrusion composite thermal conductivity higher than 450 ° C. And application Hasselman model to calculate the thermal conductivity of the composite material, the theoretical value is greater than the measured value, which is due to Cu and Al situ reaction cause resistance increased. For electronic packaging materials Another important thermal properties of the thermal expansion coefficient for analysis. Different Cu contents for the coefficient of thermal expansion, and the experimental results show that with the Cu content is increased, the thermal expansion coefficient decreases. And 400 ° C after extrusion the thermal expansion coefficient of the composite material is greater than 450 ° C extruded composite material, and applying the the Kerner model and the two temperature extrusion thermal expansion coefficient of the obtained composite material Found comparison, found that low temperature, the error is large, when when the temperature is raised to 250 ℃ later, the error is smaller. This is caused due to the thermal residual stress release rate varies with temperature. By cold isostatic pre suppress hot extrusion method ultimately prepared density less than 4g/cm to 3, the thermal conductivity greater than 130W / m · K, the thermal expansion coefficient of 10 × 10-6K-1, the tensile strength at 220MPa performance of Al-based electronic packaging materials to meet the demand for the performance of electronic packaging materials in the aerospace field.

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