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Study on Production Capacity Improvement of Semiconductor Assembly and Test Based on OEE

Author: ChenKeLou
Tutor: ZhouErMin
School: East China Jiaotong University
Course: Management Science and Engineering
Keywords: production capacity improvement OEE semiconductor assembly and test
CLC: TN305.94
Type: Master's thesis
Year: 2012
Downloads: 33
Quote: 0
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Abstract


As the semiconductor assembly and test industry need to invest a lot of expensiveequipment, coupled with fast product updates bring the equipment updates requirement,companies have a huge of financial pressure and cost burden. Therefore need to find capacityand feasible method of improve overall equipment effectiveness, improve the effectiveproduction capacity and control costs, to reduce product cost, promote enterprise develop inthe fierce market competition.This study with enhance the capacity as the end result, and the QFP production line of Asemiconductor assembly and test company for the study object, research idea to start in threeparts. First, apply the TOC method to find the bottleneck process of QFP production line,inorder to eliminate the bottleneck process constraints for production capacity, to collect theproduction status data of production equipment, according to the method of OEE classifiedstop loss time and establishing OEE model. Second, against the three major factors of causingfor the loss of OEE in the model, application of fish-bone diagram to do causal analysis, findout primary and secondary causes of resulting in the loss, made the point improvement planand formulate improvement program against of the three largest loss of OEE. Third,implementing improvement programs, conduct special improvements for downtime, withfish-bone diagram and FMEA method to focus on improvement; lead into the TPMmanagement, implement specific measures to reduce planned maintenance downtime; dooptimization process with the IE method to shorten the change time of production batches,respectively achieved encouraging improvement results.Through the implementation of improvement programs, evaluation of results, OEElosses reduced by8.3%, production capacity upgraded290thousands, achieved very gooddirect and indirect benefits. Have achieved the research purposes of optimized productionconditions, reduce the OEE loss and improve productivity, finally achieved lower productioncosts and increased benefits.

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Semiconductor technology > General issues > The semiconductor device manufacturing process and equipment > Packaging and cooling issues
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