Dissertation > Excellent graduate degree dissertation topics show

The Study of Nanoparticles Enhanced Sn Ag0.3Cu0.7Lead-free Solder Paste

Author: WangTao
Tutor: DuChangHua
School: Chongqing University of Technology
Course: Materials Science and Engineering
Keywords: flux Sn-Ag-Cu solders paste Ni nanoparticles the IMC
CLC: TG425
Type: Master's thesis
Year: 2013
Downloads: 58
Quote: 0
Read: Download Dissertation

Abstract


With the popularity of global lead-free surface mount technology, lead-free solderpaste increasingly much attention and emerged a series of lead-free solder paste with Sn assubstrate.The Sn-Cu-Ag solder paste is considered to be instead of the traditional leadedsolder paste preferred, because it has good wettability, liquidity, and good high temperaturestability and good fatigue resistance and creep resistance.This article based on thesurfactant compound, orthogonal test and optimization to get excellent comprehensiveproperties of flux, then the chosen fluxes were mixed with Sn-Ag-Cu alloy solder tosynthesize lead-freesolde Paste.The Sn-Ag-Cu solder paste which has highly active andlow residual was chosen by the standard to test its performance. The results showed that:（1） Through theoretical analysis, selected the solvent composition and mass ratio ofthe flux as follows: ethanol, glycerol,1.2-propanediol: ether A=2:4:3:1. When the ratioof hydrogenated rosin, polymerized is3:1and the mixed rosin in flux is30wt%to40wt%,after welding the spreading rate of solder joint is good and with the least residues;Activator compound is selected as the oxalic acid: citric acid: triethanolamine when theratio of1:1:2, the flux’s activity is stronger and the PH value of5.09, after welding thesolder joint is rule full and with the least residues; Surfactant selected0P-10emulsifierwith an anionic surfactant B is1:1, and the added mass fraction of0.5wt%to1.5wt%,the flux’s activity and the spreading rate of solder joint were improved.（2） The selected factor of orthogonal experiments influence on spreading rate ofsolders joint order: solvent＞activator＞surface active agent＞complex rosin.Afteroptimization again get three groups of flux which has similar to the performance standards,the spreading rate up to74.01%.Compared with a commercially available flux the activityis higher and less corrosive; Stronger the activity of flux, better the spread rate of solderson the Cu-substrates, and the wetting property increased;The excessive film-forming agentwill reduced the liquidity of solder and influenced the actiity of the flux.（3） Three types of solder paste was Prepared and the spreading area of printing solderis up to62.59mm2,the least residues of flux in solder paster about4.8wt%. Stronger theactivity of flux, better the spreading area, and the temperature distributions in moltensolder were more evenly, which could result in accelerating of the diffusion of Sn atomsand Cu atoms. The thickness of IMC was thicker and more continuous with increasing ofthe combining Sn atoms with Cu atoms. （4）Added nano-Ni particles can occur in the brazing material the surface of the moltenSnAg0.3Cu0.7to reduced the the surface tension and improved spreadability.The thickessof IMC increased and changed the morphology from a scalloped structure into a planartype structure when the Ni nanoparticles mass fraction of0.05wt%and0.1wt%, Morover,there was some small Kwai petaloid （Cu,Ni）6Sn5compounds on the IMC surfaceprotrusions.（5） During the hermal aging process, the thickness of IMC was inceresed with theaging time and changed the morphology into a planar type structure. The morphology ofIMC unchanged basically when the Ni nanoparticles mass fraction of0.025wt%, Morover,enhanced the growth of （Cu,Ni）6Sn5and suppressed that of Cu3Sn when the Ninanoparticles mass fraction of0.05wt%and0.1wt%, the thickness of IMC was inceresedObviously compared without the addition of Ni nanoparticles.

Related Dissertations

  1. Powered Activited Carbon-UF for Treating Micro-polluted Surface Water,X703
  2. Generalized Multi-Flux Method for Simulating Directional Radiative Transfer in Participating Media,TK124
  3. Parameterization Design and Research of Permanent Magnet Synchronous with Fractional-slot and Concentrated Winding,TM341
  4. Research on an Axial/Radial-Axial Flux Compound-Structure Permanent-Magnet Synchronous Machine Used for Hybrid Electric Vehicle,TM341
  5. Research on Induction Motor Vector Control System Adapting Multi-Bus Communication Mode,TM346
  6. Methane and Carbon Dioxide Fluxes from Spartina Alterniflora Marsh in Minjiang River Estuary,X502
  7. Plant-mediated Methane Transport and Methane Emissions from Phragmites Australis Marsh in Minjiang River Estuary,X502
  8. Study on Nitrogen and Phosphorus Release Fluxes of Sediment-water Interface in Dutang Reservoir,X524
  9. Preparation of Polysulfonate Ultrafiltration Membrane and Application on Oil Decolorization,TQ320.721
  10. Effect of High-flux Hemodialysis on Nutritional Ststus of ESRD Patients,R692.5
  11. Study on Exogenous Pollutants Flux in East Taihu Lake, Yangcheng Lake and Ecological and Economical Evaluation of Fish Multiplication,X524
  12. Study of Low Speed Control Strategy on Induction Motor Speed Sensorless,TM343
  13. The Studies of Proton Transfer and Its Effects on Other Ion Transport in Reverse Osmosis Composite Membrane,TB383.2
  14. Thermal Field Analysis for Pot of 320t Torpedo Car with Finite Element Method,TF341.5
  15. Experimental Research on Process Parameter Optimization for Selective Wave Soldering,TG425.1
  16. Preparation and spectral properties of rare earth doped alkaline earth silicate phosphor matrix,TN104.3
  17. Research on A-TIG and A-LBW of Austenitic Stainless Steel,TG456.7
  18. The Research on Stator Flux Estimation in Direct Torque Control System of Permanent Magnet Synchronous Motor,TM341
  19. The Magnetic Flux Leakage Testing Method and System for Washover Pipe Thread,TE92
  20. Research on Matrix Converter Fed Induction Motor Vector Control System,TM346
  21. Research on the Application of Fundamental Magnetic Flux Compensation-type Series Hybrid Harmonic Suppression Device,TN713.8

CLC: > Industrial Technology > Metallurgy and Metal Craft > Welding, metal cutting and metal bonding > Welding materials > Brazing materials
© 2012 www.DissertationTopic.Net  Mobile