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Study on the Interfacial Reaction and Performance of Sn-1Zn-XAg/Cu

Author: ZhouShuai
Tutor: WangLiFeng
School: Harbin University of Science and Technology
Course: Materials Processing Engineering
Keywords: low-Ag solder wettability melting point IMC performance ofnano-indentation
CLC: TG454
Type: Master's thesis
Year: 2013
Downloads: 8
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Abstract


The countries all over the world are committed to the research in the field oflead-free solder now, Sn-Zn system solder is expected to become a new generation oflead-free solder because of its melting point closest to the traditional solder. However,because of its poor wettability in the surface of Cu and bad oxidation resistance,Sn-Zn binary alloy can hardly be directly used for electronic products. Usingmicro-alloying method to improve the performance of the Sn-Zn based solderwettability and other properties has certain practical significance. The influence of itsmelting point, wetting properties, microstructure, IMC and nano-indentationhardness and elastic modulus by adding the third element of different content ofAg(mass fraction is0-1.0wt.%) are studied in this article.The melting of behaviors of Sn-1Zn-xAg alloys were examined by differentialthermal analysis.It was found that the addition of Ag makes the melting point of thebrazing material have a slightly floating, but the change is not large. And the meltingpoint of solder is minimum when the content of Ag is0.3wt.%. With the increase ofthe Ag contents, the spreading area of Sn-1Zn solder on Cu substrate appear the trendof increasing at first and then decreasing. The spreading area is the largest and thewettability is the best when the content of Ag is0.3wt.%.The microstructure of Sn-1Zn matrix are gray matrix organization (Sn rich)and black needle-like organization (Zn rich), needle-like Zn-rich phase decreasedwith the addition of Ag elements. The decreasing trend is not obvious when thecontent of Ag element was0.1wt.%, but the trend is obvious when the content of Agelement increased to0.3wt.%; When the content of Ag element reached to0.5wt.%,granular compound phase of Ag-Zn formed in the solder. And the compound phasecontent increased obviously when the content of Ag element was1.0wt.%.Analysis found that when the content of Ag is less than0.3wt.%, the thicknessof IMC reduced with the increase of the Ag content through the observation of Sn-1Zn-xAg/Cu solder interface IMC, but increased when the content of Ag higherthan0.3wt.%; And after150℃temperature and different times of aging, IMCthickness increased and the growth rate of Sn-1Zn-0.3Ag/Cu IMC is the smallestwhich illustrate that0.3wt.%Ag inhibitory best effect on IMC.By using nano-indentation method and displacement curve we can measure theindentation hardness Hit and elastic modulus E of Sn-1Zn-xAg/Cu solder alloy BGAsolder joint. It shows that Hit and E increase with the increasing of Ag content.

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CLC: > Industrial Technology > Metallurgy and Metal Craft > Welding, metal cutting and metal bonding > Welding process > Brazing
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