Dissertation > Excellent graduate degree dissertation topics show

Study on SiP Reliability and Failure Analysis Technique

Author: LinNa
Tutor: LiGuoYuan; LaiPing
School: South China University of Technology
Course: IC Engineering
Keywords: System in Package (SiP) failure analysis reliability magnetic microscopy through silicon via (TSV)
CLC: TN405
Type: Master's thesis
Year: 2013
Downloads: 83
Quote: 0
Read: Download Dissertation


System in Package (SiP) is an important technology able to assemble multiple activeelectronic components of different functionalities in a single unit systematically, providingmultiple functions as a system or sub-system. A SiP may optionally contain CMOS ICs, RFICs, passives, MEMS, optical components, and other packages and devices. It is soprospective that has attracted pervasive attention because it provides integration flexibility,faster time to market, fine processes compatibility and lower R&D cost.Especially in the United States, Europe and some Asian developed countries, researchon design, manufacturing processes, and reliability for SiP is in far ahead of domestic.However, the domestic market also has a huge demand for SiP, we face serious challenges indefect diagnosis and failure analysis technique, and the studies of reliability just stay in thesimulation stage. Therefore, it’s of use and importance to study the reliability and failureanalysis technique for developing SiP technology.In this paper, we focus on searching the right defect location and failure analysistechniques to improvement the reliability of SiP. Different packaging structures used for SiP,including stacked die package, package on package (PoP) and through silicon via (TSV)interconnection, and corresponding common defects are analyzed. In this paper, fouradvanced failure analysis techniques have been introduced, including3D X-ray microscopy,lock-in thermography (LIT), magnetic microscopy and FIB.Finally, two cases of failure analysis in typical SiP devices are shown. One is solder jointdefect analysis of PoP and another is ESD failure in stacked die package. Not only3D X-rayand magnetic microscopy technology are applied to the cases, but destructive physicalanalyses are performed for result contrast and illustration. Assisted verifications with casesprovide a reference for exploring the best resolution for SiP different failure modes.

Related Dissertations

  1. Development and Preliminary Application of the Questionnaire on Emotional Labour of the Middle School Teacher,B841
  2. The Research on Reliability of Low-Voltage Power Line Communication,TM73
  3. The Research and Application of Software Reliability Test for User Right Management System,TP311.53
  4. Research on Subsea Pipeline Repair Coupling,TE973
  5. Research and Application on Reliability Technology of Mine Hidrological Monitoring System,TD742.1
  6. Body Sensor Networks Adaptive Communication Protocol,TP212.9
  7. Periodic testing of the storage system reliability model,O213.2
  8. The Development of a New Portable Internal Combustion Blast Tamping Machine,U216.631
  9. Reliability Robust Design of Impeller of Large Centrifugal Compressor,TH452
  10. Fatigue Reliability Sensitivity Analysis and Reliability Robust Design of High Speed Train Wheel,U270.33
  11. Reliability Analysis of Vertical Breakwaters,U656.2
  12. Fatigue Reliability Sensitivity Analysis of High Speed Rail Axle,U270.3
  13. Research on Modeling and Simulation of Shearer Based on Virtual Prototype Technology,TP391.9
  14. Research on Human Error and Reliability of Railway System,U298.5
  15. Research on the Failureanalysis of Plate Heat Exchanger,TK172
  16. Research on Strategy of Reliability Test for Electronic Products with Characteristic of High Reliability,TB114.3
  17. The Research to Distribution System in Residential Area of Shengli Oilfield,TM727.2
  18. Application of the Coal-powered Anti-grade Trip Protection System,TM732
  19. The Research on Reliability Improvement of Distribution Network in Shanwei,TM732
  20. Failure Analysis on Superheat Section Connecting Pipe Flange of Ethylene Cracking Furnace,TQ221.211
  21. Zhaoqing Power Grid 2010-2013 Supply Reliability Planning,TM732

CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Manufacturing process
© 2012 www.DissertationTopic.Net  Mobile