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Analysis of Power Integrity Analysis for Power Distribution System Designation

Author: LiuLiJuan
Tutor: YangBingChu; YuShengFa
School: Central South University
Course: Electronic Science and Technology
Keywords: Power Distribution System Power Integrity DecouplingCapacitor Electromagnetic Band Gap
CLC: TN41
Type: Master's thesis
Year: 2013
Downloads: 31
Quote: 0
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Abstract


Integrate circuit electronic backboards such as Embedded processor board, industrial control panel, and computer peripheral equipment and reinforce, are widely used in aviation, spaceflight, automobile, industrial control and so on. Today, electronic backboard has the developing current of high density, high speed, high power, but lower voltage and bigger current. Problems of power integrity (PI) become obvious. For instance, unreasonable backup, deficient decoupling capacitors, simultaneous switching noise (SSN), and plane noise severely affect the quality of high speed signals. Power distribution system (PDS) on board applies power energy for every part on Printed Circuit Board(PCB). Thus providing constant voltage, decreasing power noise due to complicated interconnect structure become researching hot topics.This paper discussed the method to analyze Power Integrity (PI), modeling for pivotal interconnect and power/ground planes. The effect of discontinuous interconnect, layout and wiring, parts to PI have been discussed. The study is about one circuit board which is an interface control processor board applied in one multifunctional display. Analysis of PI problems helps optimizing the designation of VRM, decoupling capacitors network and power/ground planes.The thesis studied the target impedance method for designing the decoupling capacitors network on PDS. The hierarchical division thought to design the decoupling capacitors network was proposed. The effects of different packaging elements such as vias and traces to the PDS impedance were analyzed. Meanwhile, this research fruit was applied to the PDS designation of project MWG108B. By integrating the single node simulation and multiple nods simulation method, the PCB has become more efficiency of the number and locations of decoupling capacitors, and has passed the electromagnetic tests. This paper summarized concepts and causes of power noise, researched the method of depress power noise by analyzing SSN of important signal nets on MWG108to The accurate study need computing S-parameter model of vital signal nets from Slwave, then the model was exported to Designer to compute SSN on signal nets. The paper studied the characteristics of new alternating impedance electromagnetic bandgap (AI-EBG). By comparing AI-EBG to split L-EBG, characteristics and isolation effects to high frequency noise have been discussed. Meanwhile, AI-EBG was applied to decrease the power plane noises on PDS.

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > Printed circuit
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