Dissertation > Excellent graduate degree dissertation topics show

Research on Design and Preparation of SiC-based Wireless High-temperature Pressure Sensor

Author: LiYing
Tutor: LiangTing
School: University of North
Course: Electronics and Communication Engineering
Keywords: SiC capacitive pressure sensor MEMS wireless passive resonant frequency pressure sensitive membrane
CLC: TP212
Type: Master's thesis
Year: 2014
Downloads: 9
Quote: 0
Read: Download Dissertation

Abstract


Given that the traditional silicon-based MEMS pressure sensor has some limitationswhen using at high temperature, humidity and other complex environments, the paperdesigned a SiC-based wireless high-temperature pressure sensor, which can overcomesensitive structural instability and electrical lead performance degradation for traditionalpressure sensor working at high-temperature environment. As a new third-generation wideband gap semiconductor material, SiC material semiconductor device can adapt to hightemperature, high frequency, high power working conditions. Considering the MEMSprocessing technology for SiC material continues to mature, preparation of SiChigh-temperature pressure sensor has important practical significance.Combining with the present research status，the paper elaborated the principle, structuraldesign and preparation, and other related structural verification of SiC-based high-temperaturepressure sensor. According to the principle of mutual coupling of electromagnetic induction,the external pressure can change the resonant frequency of the variable capacitance sensorcircuit which in turn causes the significant changes of equivalent impedance of the test loop.Effective information of the external pressure is obtained by observing the variation of thischaracteristic. The wireless coupling measurement is to avoid the electrical leadinterconnection between devices which can be used in high temperature and other harshenvironments.The capacitor and inductor structure model of the high-temperature pressure sensor wasestablished in the paper, and the design of structure parameter was presented in details. At thesame time in order to verify the reasonableness of the design of the capacitor structure, thepaper provided ANSYS simulation and theoretical analysis for the deflection and stresses onthe sensitive membrane structure, and gave the deflection and stress curve within the range ofpressure changes. Combined with the design of sensor and the existing MEMS processing technology, a preparation scheme was developed in this paper, the key techniques and processvalidation involved were analyzed in details.Finally, capacitor varistor structure was prepared using silicon material instead of siliconcarbide material in order to test the sealing performance of the capacitor cavity, and analyzethe sealing problems of chips. The capacitor and PCB inductor coil were connected by wirebonding to form a wireless capacitive pressure sensor, and the sensor was tested underuniform pressure at a room temperature. The test results show that using the wireless passivecapacitor pressure sensor fabricated by MEMS technology is feasible in practice.

Related Dissertations

  1. Fabricationand Properties of SiC-AlN Multiphase Ceramics Prepared by Gelcasting,TQ174.62
  2. Calibration and Application of Inertial Measurement Unit Based on MEMS Gyro,V241.5
  3. Automatic Identification Based on the Resonant Frequency of the Ultrasonic Power,TG663
  4. Study of Micro Electron Mechanical System Performance Based on Temperature Field of Casimir Potential Energy,TH703
  5. Silicon pressure sensor design of analog-digital conversion circuit,TP212.1
  6. The Design and Manufacturing of Micro-plasma Source in Micro Mass Spectrometer for Gas Samples,O539
  7. Low driving voltage RF MEMS Capacitive Switch Design and Analysis,TM564
  8. Research on Wafer Lever MEMS Vacuum Measurement Device,TB77
  9. Design and Fabrication of Micro Fabry-Perot Tunable Filter,TN713
  10. Research on Key Technology of MEMS Wafer Level Vacuum Packaging Based on TSV,TP211.4
  11. Refinement-oriented Geometrical Modeling and Manufacturability Analysis for Surface Micromachined MEMS,TP211.4
  12. Research on Wavelength Selective Switch Based on MEMS Technology,TN256
  13. Structure Design and Process Integration of Wafer Level Vacuum Packaging for MEMS,TN305
  14. The Research of Single Patchand Compact Dual-Band Microstrip RFID Antenna,TN822
  15. Design, Modeling and Fabrication of Micropump Actuated by Laser-induced Shock Wave,TH38
  16. Study on Temperature Field and Residual Stress Model Research of MEMS Accelerometer,TH824.4
  17. Fabrication and Characteristics of Micro-Bubble Generator Based on Carbon Nanocoils,TP211.4
  18. Research on Detection and Control System of Capacitive Micro-accelerometer with Round Proof Mass Supported by Multi-Beam,TH824.4
  19. A Model for the Pull-in Parameters of Torsional Magnetostatic Actuators with Fringing Effect,TP211.4
  20. Research on Micro Flexible Thermal Shear Stress Sensor Array with Floating Structures,TP212
  21. Design and Research on Attitude and Heading Reference System Based on MEMS Inertial Sensor,V241.5

CLC: > Industrial Technology > Automation technology,computer technology > Automation technology and equipment > Automation components,parts > Transmitter ( converter),the sensor
© 2012 www.DissertationTopic.Net  Mobile