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Design of High-frequency Ultrasonic Transducer for Wire Bonding and Research on Motion Control of Bond Head

Author: WangFuJun
Tutor: ZhangDaWeiï¼›ZhaoXingYu
School: Tianjin University
Course: Mechanical Manufacturing and Automation
Keywords: ultrasonic transducer dynamic analysis impedance analysis bond head motion control
CLC: TB552
Type: Master's thesis
Year: 2009
Downloads: 61
Quote: 3
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Abstract


Aimed at improving the speed and quality of wire bonder and conversion efficiency of ultrasonic energy, a methodology for designing high-frequency ultrasonic transducers is proposed and the experimental tests are also studied in detail. At the same time, it involves in the structure design and control of bond head. The following works and achievements have been accomplished.Based on vibration and wave theory, the analytical model of ultrasonic concentrator and transducer are both formulated, meanwhile, the frequency equations can be deduced. Utilizing the similarity between mechanical vibration and electrical resonance, the electromechanical equivalent circuitry of transducer system has been established. It provides basic theory for determining the topology of transducer.The topological model of transducer has been achieved by using of analytical method. It allows the vibration characteristics of the parts that compose the transducers to be elaborately investigated, and the influence of the parts to transducers is worked out. The optimal model is obtained finally through ANSYS Parametric Design Language (APDL).Experiment is carried out in order to have impedance of transducer tested. The result proves remarkable resemblance with theory and FEM.By means of modal analysis in ANSYS, the vibration forms of motion parts in a certain range have been displayed. The influence of these vibration forms to bonding process are deeply discussed as well, which contributes to optimization of structure design and motion control.The bond head motion system driven by rotary voice coil actuator is introduced in the dissertation. Some experimental test and debugging have also been presented, and the performance index of motion system is given.The work accomplished in this dissertation is very meaningful for promoting the development of wire bonder and expanding its application in integrated circuit manufacturing.

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CLC: > Industrial Technology > General industrial technology > Acoustic engineering > Ultrasonic Engineering > Ultrasonic transducer
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