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IC package oriented positioning system computer vision research

Author: LiJunLan
Tutor: ZhangDaWei
School: Tianjin University
Course: Mechanical Manufacturing and Automation
Keywords: Wire bonding Visual Positioning Microscopic optical system Camera Calibration Pattern Recognition Computer Vision
CLC: TP391.41
Type: Master's thesis
Year: 2009
Downloads: 50
Quote: 2
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Abstract


With the wire bonding technology toward fine , high-precision direction, the visual system has an impact on the accuracy of the IC package is one important factor . In this thesis, wire bonding machine vision system components are analyzed, and each of its major components: an optical system , the visual system calibration, and pattern recognition localization algorithm is studied , the text of the work and the results obtained are as follows : In the analysis of wire bonder based on the composition of the visual system , to determine its basic structure , and its hardware of choice . Meanwhile according to wire bonding machine vision system for visual orientation effect , gives the visual system teach stage and bonding stage workflow. For wire bonding machine vision system visual positioning features, design of its micro-optical systems . Imaging system uses two amplification to achieve the imaging magnification and object distance requirements, four times magnification , the working object distance is 47mm. Using critical illumination of the work area to provide a stable uniform lighting conditions. For camera calibration algorithm is studied , the planar self-calibration method first used in microscopy system, and made a calibration accuracy of analytical methods . On the accuracy by experiment were analyzed with respect to the experimental results show that the calibration of the calibration chip precision can reach ± 2μm, visual positioning accuracy to meet the requirements for system calibration . Using normalized grayscale correlation template matching method as wire bonding machine vision system localization pattern recognition algorithms, and the simulation experiment results show that positioning accuracy can reach ± 3.5μm. Study of global calibration algorithm , the obtained chip and the lead frame to the control system, the position deviation , in order to achieve the visual positioning to ensure the accuracy of the bonding .

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CLC: > Industrial Technology > Automation technology,computer technology > Computing technology,computer technology > Computer applications > Information processing (information processing) > Pattern Recognition and devices > Image recognition device
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