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Analysis of Signal Integrity in the High-speed Circuit

Author: LiZuoMin
Tutor: GuChangQing
School: Nanjing University of Aeronautics and Astronautics
Course: Electromagnetic Field and Microwave Technology
Keywords: High - speed interconnect system Signal Integrity Full-wave electromagnetic analysis Discontinuities Crosstalk Simultaneous switching noise
CLC: TN431.2
Type: Master's thesis
Year: 2009
Downloads: 192
Quote: 1
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Abstract


Signal integrity issues has become an urgent need to address the key issues in the design of high-speed digital circuits . With the continuous improvement of the high - speed digital circuit operating frequency , the signal rise / fall time changing short circuit ever-increasing integration , delay, reflection , crosstalk , overshoot, ringing and simultaneous switching noise and signal integrity issues have become increasingly prominent . Signal integrity analysis of the problem is essentially a complex electromagnetic field boundary value problem solving , in order to accurately analyze this complex electromagnetic effects , electromagnetic field theory based on the full-wave electromagnetic analysis method for solving complex electromagnetic field problems . This paper focuses on electromagnetic modeling and simulation of the spindle , the typical structure of the high - speed circuit signal integrity analysis from the time domain and frequency domain . In this paper, the major work done : 1. Apply three-dimensional full-wave electromagnetic simulation software for high-speed interconnect in common microstrip interconnects and the common discontinuity signal integrity performance analysis ; explore go with the signal crosstalk between the lines transition time , to go the distance between lines , the height of the reference layer parameters such as changes in the law ; Add multi-point grounding of the buffer zone to reduce crosstalk between adjacent traces , and the size of the buffer zone and the spacing between vias selection discussed simulation shows good grounding of the isolation zone can effectively reduce the crosstalk between the signal lines ; 3 for the the incomplete reference surface ( non - ideal return path ) , the slot size in the case of changes in the digital / analog isolation on the influence of crosstalk analysis and complete reference by adding capacitance to improve the face of the impact of crosstalk ; due to the presence of simultaneous switching noise ( SSN ) , makes the PCB there is a problem of electromagnetic interference , this paper analyzes the causes of simultaneous switching noise , the use of different EBG structure ( EBG ) to suppress SSN proposed EBG structure using porous mixed inhibition the SSN method , the validity of EBG suppression SSN method is verified by simulation . Through the above research , the paper concluded solve signal integrity issues for high-speed circuit design, has a certain significance .

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > Semiconductor integrated circuits ( solid state circuits ) > Bipolar > Digital ICs, logic ICs
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