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Control and Optimization of the Whisker Defects in A High Temperature Thick Aluminum Sputtering Process
Author: WangZhiGang
Tutor: HuangQiZuo;LiuZhiNong
School: Shanghai Jiaotong University
Course: Software Engineering
Keywords: The columnar protrusions defects ( Whisker Defect ) Temperature ( temperature ) Aluminum sputtering (aluminum sputtering) Stress ( stress )
CLC: TN305.92
Type: Master's thesis
Year: 2009
Downloads: 8
Quote: 1
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Abstract
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The aluminum sputtering process is most commonly used in semiconductor manufacturing a metal interconnect technology . BCD process to meet the demand of a large current through the thick aluminum interconnection line . A BCD process in the production process , requiring in thick aluminum grown under a relatively high temperature conditions . The accumulation of stress generated in the growth process of the thick aluminum , the release of this accumulation of stress in the thin film of aluminum at the grain boundaries , resulting in anisotropic growth of the aluminum along the grain boundaries , the aluminum is formed columnar projections . In subsequent aluminum film by dry etching process , the this Aluminum columnar projection can not be etched completely clean, become fatal flaws affect product yield , defined such defects as aluminum is columnar protrusion defects . This paper describes the positioning process of the aluminum cylindrical protrusion defects , design test , analysis of possible factors such defects to identify the most influential factor on the aluminum columnar protruding defects - aluminum sputtering temperature control . And further analysis of the various factors that affect aluminum sputtering temperature control : the sputtering power , wafer transfer path , the thermal efficiency of the equipment , the various components of the process chamber temperature control ... Tested separately analyzed the degree of influence of each factor on the various factors that affect the temperature control . A balance under the existing condition of the equipment cost and quality , the quality can be guaranteed under the conditions with minimal impact on the normal production process , equipment renovation of lowest cost , practical methods to control and optimize the aluminum columnar protrusion defects . Promote the use of this method in the actual production , makes this system Chengshun production , the cost savings for the company .
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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Semiconductor technology > General issues > The semiconductor device manufacturing process and equipment > Sputtering
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