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Analysis and Improvement of Handset Smart Card Chip Encoding Machine

Author: HanZuo
Tutor: LiuXinXiong
School: Huazhong University of Science and Technology
Course: Mechanical Design and Theory
Keywords: Mobile phone smart card Virtual Simulation Finite Element Analysis Pro / Mechanism Pro / MECHANICA Structure ANSYS
CLC: TN409
Type: Master's thesis
Year: 2009
Downloads: 8
Quote: 0
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Abstract


Phone smart card chip burner is a complete smart card pre- personalization and personalization institutions curing upcoming mobile phone smart card operating system programs and mobile operators to provide application smart card . The machine is different from the traditional chip burning equipment , can burn 60 smart card , is fast and efficient . Laid the foundation to design more feature- rich smart card production equipment for the machine . In this paper based on the results of the original program prototype running , take the card in the original design agencies , collection card institutions , transport mechanism , slewing mechanism , design principles clip institutions analyzed and summarized , to find out the cause motion error of the original proposal too large design defects of the agencies of the improvement program , the main source of error for the slewing mechanism . Form of exercise and the functional requirements analysis slewing mechanism derived its law of motion ; servo motor works , summed up the error in the form of institutions , and card positioning error derived mathematical formula . The basis of the motion analysis , the establishment of a mathematical model of static analysis and dynamic time-domain analysis of the main components of the rotating mechanism , the main parts by the force of the law changes with time are obtained . In this study, in the environment of Pro / ENGINEER Wildfire3.0 slewing mechanism and improved grip institutions 3D modeling , integrated mode of Pro / Mechanism module slewing mechanism the virtual motion simulation analysis . Integrated mode Pro / MECHANICA the Structure module turntable slewing mechanism modal analysis and dynamic time domain analysis , and the use of finite element analysis model is built under the module finite element model of the turntable and the spindle ; ANSYS10.0 environment solving the finite element model of the turntable and spindle static analysis . Finally, according to the results of the finite element analysis , checking the bodies of strength, stiffness and motion error , and further optimization . The analysis from the drawings , the demonstration program , motion simulation , finite element analysis of several aspects of the study . The computer simulation results show that the improvement program to meet the design requirements .

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Application
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