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The transmitter is an important part of the communication system , the transmitter power output capacity of the key. Limited output power in a single device in the case , often need to use more power combining techniques to achieve high power output . In this paper, Ka-band solid state power amplifier technology status , combined with the communication needs of the project , the use of waveguide-based spatial power synthesis technology, developed P1dB ≥ 20W continuous wave solid-state power combining amplifier. Thesis from the power combiner circuit , thermal design and test three aspects , discusses the design and implementation of the amplifier . The amplifier using building block technology to achieve multiple power modules based MMIC power synthesis, thereby constituting a more powerful amplifier. In communication systems , solid-state power amplifier heat treatment is very important, this is also a design challenge . Paper combines the engineering requirements , and then select the pilot heat dissipation way , the use of heat pipe technology , the design of a heat pipe radiator . The method of calculation and analysis used , according to the total power amplifier power dissipation and overall size constraints , the initial size of the radiator obtained , on this basis , obtained by means of thermal analysis software to optimize the final design size of the radiator . Verified by experiments that the radiator has a valid and reliable thermal performance. In order to verify the feasibility of the design , the completion of the amplifier circuit manufacture, and the key indicators of the amplifier was tested with analysis of these indicators include output power, noise figure , clutter , IM3 and amplitude and phase transformation. The paper also from the chip quiescent operating point of the regulation and micro- assembly of two aspects of a single chip to explore the power output capability.
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