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Design and Optimize of LED Packaging Process

Author: LiChangChun
Tutor: TangYong；LaiZuoYuan
School: South China University of Technology
Course: Mechanical Engineering
Keywords: LED Package Phosphor coating Color rendering index Lumen efficiency
CLC: TN312.8
Type: Master's thesis
Year: 2011
Downloads: 171
Quote: 0
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Abstract


Light-emitting diode (LED) as a fourth-generation light source and has broad prospects for development and vitality, is one of the most social significance and economic value of high-tech 21st century, will play in the coming decades in energy saving and emission reduction significant role. LED package is located in the middle of its industrial chain links, nexus, involving optical, thermal, electrical, materials, mechanical, mechanical and other disciplines, the new cross-technology complexity. Face light color LED packaging, reliability, and cost issues seriously restricted its development in the field of general lighting in urgent need of scientists to solve. Process parameters and their impact mechanism for the research to SMD SMD power package process design and optimization, to do a more in-depth exposition of the current situation and existing problems of the LED packaging industry and technology to explore the the LED best light color. seek low-cost, high-reliability packaging technology. Through various experimental analysis to obtain the following results: 1. SMD LED packaging technology to make a detailed and comprehensive specification, and optimization of parameters in the wire bonding process, while increasing the plasma cleaning process, improve LED bracket cups silver-plated layer surface quality, making it the gold wire bonding tensile strength relative to the unwashed, an increase of 24.6%, providing a guarantee for LED reliability and yield. 2 on the phosphor coating to optimize the generation of the bubble in the formation having microprotrusions hemispherical phosphor layer structure and improve the uniformity of color; For ordinary free point adhesive coating method, the practice has proved that whether or not the stent dried important effect; consistency from the LED and combining the brightness factors considered, the particle diameter of about 8μm phosphor having a better performance in the medium-viscosity silicone and a good time under control. . Chip and phosphor matching affect the performance of the LED light color peak wavelength of 450-452.5nm, the half wavelength 20nm blue chip YAG phosphor match analysis test sample, when the target color temperature to 5700K remarkable color and color coordinate position light color, brightness, comprehensive comparison, YAG03 good match with this blue chip. 4 through the LED light color influence factors analysis experiment, found within a certain range for the same kind of chip and the phosphor made of LED, LED color rendering index is raised as the color temperature increases; For the same kind of phosphor, when Correlated color temperature is constant, the peak wavelength of the LED chromogenic blue chip regularly changes, higher peak wavelength of the LED has better color rendering properties; red phosphor for supplementary red component LED spectrum has a significant role, when the content of 10% of the LED color rendering index increases from 70 to over 80, but because of the low quantum efficiency of the red phosphor, and the light absorption, so the luminous efficiency will be substantially reduced; also explore the energization current and the junction temperature. LED optical performance. Low power SMD LED light failure reasons, the experimental results from its light fades dominant factor in attenuation is white LED blue chip warm white LED phosphor decay dominant aspects.

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Semiconductor technology > Semiconductor diode > Diodes: structure and performance > Light-emitting diodes
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