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Research on the Micro-embossing of Infrared Glass

Author: LiuJunE
Tutor: GuoZhongDa
School: Xi'an University of Technology
Course: Microelectronics and Solid State Electronics
Keywords: Ge33As12Se55 glass hot embossing technology Si-V groove mould fill rate
CLC: TN305
Type: Master's thesis
Year: 2010
Downloads: 89
Quote: 0
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Abstract


Infrared glass, a special kind of optical materials, plays an increasingly important role in Micro-optics. Study on hot embossing of this material has become an important subject. Hot embossing fabrication of microstructures with low cost, high efficiency and parallel operation has been gradually applied to all areas of micro-machining. Currently, there is no report on the research of hot embossing technology of chalcogenide glass, and our work is mainly about Ge33As12Se55 glass hot embossing technology and the molding properties.Based on the original thoughts and methods of micro-imprinting from current develop trend and related research at home and abroad, hot embossing was discussed, Si-V groove mould was designed and prepared, and the pattern of mould was tried to reduplicate to the Ge33As12Se55 glass with use of hot embossing technology. Temperature, pressure and bonding time which are important factors to affect the experiment results of hot embossing were analyzed by use of the single-factor experiment method and the orthogonal experiment method. Hot embossing experiments were taken out on the Ge33As12Se55 glass with the Si-V groove mould prepared by anisotropic wet etching, the heating equipment, as well as the self-made loading equipment. Characteristics of Ge33As12Se55 glass in hot embossing were summarized here, laying the groundwork for further research of hot embossing on the Ge33As12Se55 glass.Our study shows that hot embossing technology is a new way to fabricate infrared micro-optical elements. When the temperature is lower than the glass transition temperature Tg, the Ge33As12Se55 glass has no deformation under pressure. As the temperature rises, the Ge33As12Se55 glass has gradual softening and it will be in viscous state. Then the Ge33As12Se55 glass will be shaped quickly under pressure, and it needs to keep pressure for several minutes to overcome the elastic recovery and residual stress of Ge33As12Se55 glass. Because the range of loading pressure is restricted by the loading equipment and the friability of Ge33As12Se55 glass, the fill rate to Si-V groove mould is 80.50% under the best experimental conditions, which can not meet the requirement of precise micro-optical components.

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Semiconductor technology > General issues > The semiconductor device manufacturing process and equipment
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