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Finite Element Analysis for Thermal Fatigue Reliability of Lead-free Solder Joints in the Plastic Ball Grid Array Package

Author: LiYanHui
Tutor: HuangZaiXing
School: Nanjing University of Aeronautics and Astronautics
Course: Engineering Mechanics
Keywords: Plastic ball grid array package Lead-free solder joints Thermal cycling Damage Thermal Fatigue Life Reliability
CLC: O346.2
Type: Master's thesis
Year: 2010
Downloads: 127
Quote: 0
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Abstract


More and more, the number of solder joints , the improvement of the degree of integration with the electronic equipment miniaturization , plays the role of electrical and mechanical connection size is getting smaller and smaller , single solder joint failure can endanger the entire system the reliability issue has become the focus of research and attention . Computing platform based on ANSYS and ABAQUS , for a typical plastic ball grid array package (PBGA) numerical simulation to predict the thermal fatigue life of solder joints and complete reliability analysis , the paper consists of three parts : the first , based on Anand unified viscoplastic constitutive description of the mechanical behavior of lead-free solder joints , solder joints under temperature cyclic loading stress and strain distribution law , failure mode and deformation characteristics of the entire model and reason ; critical solder joints , plotted stress - equivalent plastic strain curve of the hysteresis loop and strain energy density curve ; the temperature dynamic characteristic curve analysis of stress and equivalent plastic strain cyclical variation ; Manson-Coffin equation to predict the thermal fatigue life . Second , based on ABAQUS heat - elastoplastic - creep - damage constitutive description of the mechanical behavior of lead-free solder joints , the distribution of temperature solder under cyclic loading stress , strain and injury law , to identify the critical solder joints ; critical solder joint stress , strain and injury cyclical variation with temperature , and plots the stress - strain , stress - temperature and strain - temperature hysteresis loop curve , based on the damage evolution trends to predict the thermal fatigue of solder joints life. Third , based on the Monte Carlo method and finite element simulation analysis of the random distribution of the initial damage, the impact on the reliability of the solder joint thermal fatigue life , and the results showed that : when the initial injury follow a normal distribution , the solder joint thermal fatigue life also follow a normal distribution . This conclusion can provide a reference for the assessment of the reliability of PBGA package .

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CLC: > Mathematical sciences and chemical > Mechanics > Solid Mechanics > Strength theory > Fatigue theory
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