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Alkyl carboxylic acid copper surface preparation and self-assembled monolayer Corrosion Resistance

Author: YuXiangRen
Tutor: LiShuYing
School: Dalian University of Technology
Course: Chemical Engineering
Keywords: Copper Alkyl carboxylic acid Self-assembled monolayer Corrosion and Protection Quantum chemical calculations
CLC: TB383.2
Type: Master's thesis
Year: 2011
Downloads: 138
Quote: 1
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Abstract


Self-assembled monolayers (Self-assembled monolayer, SAM) is active molecules spontaneously adsorbed by chemical bonds formed at the interface of the solid has a certain orientation and closely spaced ordered monolayer film. Under mild conditions as a film-forming method is simple and convenient, self-assembled monolayer technology is more widely studied film technologies in the field of metal corrosion and protection has a broad application prospects. Copper is an important commercial metal, with good electrical conductivity, thermal conductivity and other properties and is widely used in chemical industry, electronic industry and construction, on Copper Corrosion and Protection of corrosion science research is an important research topic. Because the copper surface in the atmosphere are easily oxidized to form an oxide of the active molecules and weakening the interaction of the copper surface, the copper surface active molecules SAM more difficult. However, the study of metal corrosion protection standpoint, the copper surface preparation of self-assembled monolayers and further study its effect on copper substrate corrosion protection not only of theoretical significance, but also has important potential applications. Copper surface generated alkyl carboxylic acids SAMs solid poor, in order to improve the self-assembled monolayer alkyl carboxylic acid and copper binding, this thesis is very simple auxiliary surface oxidation in alkaline copper foil surface was prepared Cu (OH) 2 nano-pillar arrays quasi / CuO micro-flower hierarchical structure, using self-assembly techniques in the surface of this hierarchy ordered assembled monolayer of stearic acid and oleic acid film. Stearic acid and oleic acid in the formation of the SAM, the environment vulnerable to other factors. Therefore, in order to enhance the degree of self-assembled monolayer of dense, select the appropriate conditions for self-assembly to improve self-assembled films on copper corrosion resistance, AC impedance technique using stearic acid concentration, self-assembly process conditions to optimize the time to explore the Cu ( OH) 2 nanorods / CuO micro flowers hierarchy of stearic acid and oleic acid SAM surface optimum deposition conditions. The experimental results showed that: in the case of other conditions are the same, within certain limits, the greater the concentration of stearic acid and oleic acid, the longer the self-assembly, self-assembled monolayers on copper substrate corrosion protection ability is stronger, stearic acid self-assembly film corrosion performance than oleic acid self-assembled monolayer. This thesis also uses steady-state polarization curves, cyclic voltammetry measurement techniques stearic acid and oleic acid corrosion resistance of SAM for a more detailed characterization, stearic acid and oleic SAM measured in 0.1M NaCl solution for corrosion protection properties of copper base to explore the self-assembled monolayer of stearic acid and oleic acid inhibition mechanism of copper. As hydrophobic SAM, can effectively prevent corrosion of the copper ions in contact with the substrate and thus to a considerable extent, inhibit the corrosion of copper. Fourier transform infrared spectroscopy and contact angle indicates that stearic acid SAMs orderly than oleic acid self-assembled monolayer, so stearic acid SAMs stronger hydrophobic self-assembled monolayer of oleic acid, stearic acid and thus self-assembled monolayer corrosion performance than oleic acid self-assembled monolayer. By quantum chemical calculations, stearic acid derived SAMs oleic acid corrosion resistance superior to SAMs reasons: oleic acid C = C double bond and carboxyl competitive adsorption in CuO / Cu (OH) 2 surface, two reactive sites of different alkyl chain is not conducive ordered.

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