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Laser Exposure Equipment for PCB with Large-area by the Way of Scanning and Projection

Author: OuYangQin
Tutor: ZhouJinYun
School: Guangdong University of Technology
Course: Physical Electronics
Keywords: Exposure Machine Printed circuit board Laser projection imaging XeF excimer laser Resolution
CLC: TN249
Type: Master's thesis
Year: 2011
Downloads: 72
Quote: 0
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Abstract


With the demand for large area , high resolution imaging of electronic products , printed circuit board design and manufacturing requirements . It also promoted the development of the exposure required for PCB production equipment . Meanwhile, the continuing pressure of the manufacturing cost , the required equipment to meet its performance requirements while also reducing cost . By increasing the production volume , using conventional photoresist critical factor . The defects of the traditional PCB exposure tools storm gradually leak out : limited substrate size , low- production joint error , low accuracy , poor efficiency , high cost . A new type of laser projection imaging (LPI) exposure emerged to replace the traditional mercury lamp exposure , 351nm XeF excimer laser as its light source . And the exposure is performed using conventional photoresist , traditional melting quartz glass reticle . Based on the the LPI system theory , we have developed a laser lithography equipment , as long as we adjust the appropriate parameters , the device can be achieved in the area of 460mm × 610mm substrate large area of ??exposure , and reach the resolution of 10μm . It eliminates the current limit of the lithographic apparatus . The advantage is that it can be in the PCB manufacturing immediately be applied without the need to make any changes on the photoresist lithography process . The equipment consists of four main parts : the wavelength of 351nm , the single pulse energy of 120 mJ XeF excimer lasers ; numerical aperture of 0.02 , uniformity is reached within 5% of the illumination optical system ; a dual telecentric optical numerical aperture of 0.025 projection systems ; control both the mask and the substrate scanning XY precision moving table imaging completed until the substrate . This paper describes the structure of the exposure machine , exposure optical design parameters and mechanical design and processing , and analysis of the problems of optical and mechanical matching and reasonable technical solutions . Finally, in the set under different conditions , on the laser projection exposure machine exposure experiments , to obtain the optimal exposure parameters .

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Photonics technology,laser technology > Laser technology, the maser > Laser applications
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