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Step Sn-Ag alloy plating bump Preparation and process optimization
Author: BiJingLin
Tutor: LiMing
School: Shanghai Jiaotong University
Course: Materials Science
Keywords: Bump Sn-Ag alloy Electroplating step Interfacial reaction Reflow
CLC: TN405
Type: Master's thesis
Year: 2012
Downloads: 48
Quote: 0
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Abstract
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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Manufacturing process
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