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Crystal wafer automatic sorting technology research

Author: GuoQingWen
Tutor: WangQingBao
School: Nanjing University of Technology and Engineering
Course: Optical Engineering
Keywords: Process communication Image Rotation Feature Extraction Defect Detection
CLC: TP274
Type: Master's thesis
Year: 2012
Downloads: 17
Quote: 0
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Abstract


The twenty-first century, mobile phones, computers and other electronic products become an integral part of people's lives , they have a common feature is the CPU, CPU clock speed represents the processing speed of the device , an external crystal oscillator frequency is the CPU frequency reference source . Crystal with its high accuracy, high stability and low price have been widely used, however, the presence of crystals in the wafer chipping , scratches and stains and other defects , resulting in crystal frequency instability , seriously affecting its performance. Therefore, how to quickly and accurately detect minute defects and defect-free crystal wafer production has a very important significance. In this paper, based on digital image processing technology crystal wafer sorting to do in-depth research , combined with the characteristics of crystal chip design based on digital image processing technology, automatic sorting system . This paper describes the image acquisition system hardware construction, including the selection of the light source and the camera , the lighting program design ; secondly describes image acquisition system control program and an image acquisition system and image processing control program coordination between the work ; and describes the image pre-processing of the wafer image processing algorithms ; Finally need to detect large chip missing angle chamfer , chamfer inside the tiny chipping , cracks, stains wafer defects , proposed and implemented specific detection algorithm. According to the characteristics of the wafer image , design defects detected in the order of the first detection then detects the edge of the wafer inside the chip . Rectangular shape for the detection chip , proposed a Hough transform based method for detecting defects found a Hough transform and gives improved method . In the wafer edge is detected, the image is rotated against the edge information of the wafer characteristics of image rotation algorithm is improved , so that rotation time reduced from 170ms to 47ms. To accurately detect the slight lack of wafer chamfer angle , rotating the wafer level , proposed a modified rotation algorithm , long while rotating the wafer level, deviate from one end of the horizontal distance from the horizontal line at three pixels or less.

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CLC: > Industrial Technology > Automation technology,computer technology > Automation technology and equipment > Automation systems > Data processing, data processing system
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