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Ether sulfone ketone with the molecular main chain aromatic rings and ether, sulfone, ketone key special high temperature engineering plastics.It has excellent mechanical and physical properties, fire resistance, chemical corrosion resistance, peel resistance, radiation, hydrolysis, impact resistance, creep resistance, insulation and stability, easy processing properties, in recent years in high technology, civil and aviation Industry has been widely applied and developedThe paper includes the following sections:1. Poly ether ketone ketone / poly ether sulfone ether ketone (PEKK/PESEKK) copolymer were synthesized from 4,4’-diphenoxy diphenylsulfone(DPODPS), diphenyl ether (DPE) and terephthaloyl chloride (TPC) in the presence of anhydrous aluminum trichloride(AlCl3), N,N-dimethylformamide(DMF) and 1,2-dichloroethane (DCE) by low temperature polycondensation. Copolymers were characterized by 1H-NMR, FT-IR, DSC and TGA. Their solubilities were also tested. The results showed that copolymers are expected, have high glass transition temperature and thermal stability. The inherent viscosity of the copolymers is more than 0.65 dL/g which conducted by Ubbelodhe viscometer and calculated by the One-Point Method. Copolymers have good chemical resistance only soluble in dichloroacetic acid, tetrachloroethane in room temperature even by heating.2 Poly ether sulfone ether ketone ketone with pendent carboxyl groups prepared from DPODPS and trimellitic anhydride chloride (TMAC) in the mixture solvent of N-methyl pyrrolidone (NMP) 1,2-dichloroethane (DCE), for anhydrous aluminum trichloride(AlCl3) as catalyst.’H-NMR and FT-IR characterized the chemical structures. The result carried on TGA show that the 5% weight loss was 324.6℃. Polymer has excellent solvent resistance. resistance for the ion exchange and adsorbent resin as base material of the conditions provided. PESEKK-A and its sodium salt with adsorption of metal ions, is a novel structure of the weak acid cation exchange resins and adsorbents.3. Poly ether sulfone ether ketone ketone containing epoxy groups (PESEKK-E) were obtained from PESEKK-A and epichlorohydrin, in the presence of tetrachloroethane and sodium hydroxide as catalyst. The values of epoxy are in the range 0.04 to 0.12 by titration. The heat curing strategy were investigated for 4,4’-diaminodiphenyl sulfone (DDS) as curing agent. The PESEKK-E was characterized by FT-IR, TGA and DSC. The results showed that:the polymer with the desired structure, curing characteristics of each of the major peaks showed 150℃/ 2h + 180℃/ 2h +200℃/ 1h for a better cure. Spectrum from the TG and DSC analysis showed that the decomposition temperature of the resin cured in the range of 240～250℃, through the epoxy curing agent, resin, glass transition temperature does not appear, may be the resin of the thermal decomposition temperature lower than Tg Reasons.4. 1,1-bis-(4-hydroxyphenyl)-cyclohexane was synthesized from cyclohexanone and phenol in the presence of HCl and mercaptoacetic acid as mixture catalysts. Then a novel transparent or light yellow epoxy resin was obtained from 1,1-bis-(4-hydroxyphenyl)-cyclohexane and epichlorohydrin for sodium hydroxide (NaOH) as catalyst. The chemical structure of the resulting Epoxy resin was characterized by FT-IR and 1H-NMR. The epoxy value of the titled resin was determined by the method of titration. The epoxy resin was cured by thermal curing, DDS as curing agent. The chemical structure of the cured Epoxy resin was characterized by FT-IR, thermal properties obtained from TGA and DSC. The results showed that epoxy resin was expected. With hydrochloric acid - acetone titration under different conditions, the synthesis of epoxy resin, epoxy value of up to 0.463. The solubility of the resulting polymers was also tested and it show that the epoxy resin can be dissolved in acetone, halogenated hydrocarbons and other common organic solvents. The process performance is good. DDS cured with double-cyclohexyl Phenol epoxy resin, the 5% weight loss at 315℃,220℃not previously appeared in the glass transition, Tg may be higher than the initial thermal decomposition temperature of the reason, over heat resistance.
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