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Plastic Ball Grid Array Solder Joint Reliability Assessment under Combined Cycling and Vibration Loading Conditions

Author: DengDingYu
Tutor: HanJingLong
School: Nanjing University of Aeronautics and Astronautics
Course: Solid Mechanics
Keywords: Coupling effect Incremental damage superposition The linear superposition injury law Plastic ball grid array Reliability Solder joints
CLC: TN405
Type: Master's thesis
Year: 2011
Downloads: 98
Quote: 1
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Abstract


Automated , electronic products during use in the aerospace and military fields often encounter vibration and thermal loads simultaneously . Although for solder thermal cycling failures have been extensively studied , but the solder joints under vibration loads and thermal cycling load failure mechanisms is still quite limited . Two plastic ball grid array package components , reliability problems of a typical electronic packaging structure under the load of thermal cycling and random vibration loads coupling . The application of the finite element method of plastic ball grid array package component fatigue life under thermal cyclic loading , vibration loads , as well as two loads simulation analysis and finite element results with the test results were compared . Both results show that the plastic ball grid array package solder joints in thermal cycling loads and vibration loads under fatigue life than a lot of short life alone any kind of load . Predict solder joint fatigue life because traditional linear superposition injury law does not consider the coupling of heat load and vibration loads , so the method overestimated the fatigue life of the solder joint , this incremental damage superposition method for plastic ball grid array package solder joint reliability analysis . The method to establish the nonlinear interaction between the vibration loads and thermal cycling load , it takes into account the average temperature and thermo-mechanical stress vibration results . This method tests the authentication, and the reaction of the actual injury . This study can provide some help for reliability prediction in engineering , validation and acceleration test design .

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Manufacturing process
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