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Exhibit anisotropic etching characteristics of single-crystal silicon in the high pH value of the alkaline solution (e.g. : Salaried , KOH, NH 4 sub > OH , TMAH , etc.) , in microelectronics micro-optics , the field of micro - mechanical systems , bulk micromachined technology has been widely used . An alkaline solution of silicon micromachining , in film production KOH process production costs low, can be repeated, and KOH is therefore most commonly used in the anisotropic etching of the silicon . In this paper, a mechanistic model of KOH anisotropic etching of silicon wafers principle and anisotropic etching of silicon in alkaline solution , KOH anisotropic wet silicon back thinning experiment by mechanical polishing on the the silicon back of thinning , comparative summary of the results of both experiments and analyze the reasons for the impact of surface phenomena .
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