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Automatic wire bonder is precision machinery, automatic control , image recognition , optical , ultrasonic hot welding technology in one of the modern high - tech microelectronic packaging equipment, mainly used in integrated circuit manufacturing process chip pads and welding wire framework . The topics to develop fully automatic wire bonder system software design as the main research contents of the subject during the major work done in the papers were presented and summarized . First, automatic wire bonding machine works and technical status of the automatic wire bonder system software requirements analysis , equipment system architecture, hardware , system software overall structure and basic design methods . Secondly, the fully automatic wire bonder system software sub-module , focusing on motion control , machine vision, automatic loading and unloading system and correction system design . Each sub-module of the principle of functional requirements, hardware components , software architecture and implementation of the code . Also introduced the device automatically run the program flow . Finally , the entire device and equipment system software testing and validation , the problems found in the tests has been improved to enhance and improve the system software to meet the design requirements .
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