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Ultrasonic Fusion Bonding for Polymer Microfluidic Chips

Author: ZhangYanGuo
Tutor: LuoZuo
School: Dalian University of Technology
Course: Micro-Electro-Mechanical Engineering
Keywords: Microfluidic chip Welded joints Ultrasonic fusion bonding Hot Silicon-based technology
CLC: TN405
Type: Master's thesis
Year: 2009
Downloads: 112
Quote: 1
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Abstract


In recent years , polymer with its low cost, variety, process simplicity and good biological compatibility , etc. produced gradually become the mainstream of microfluidic chip materials, polymer microfluidic chips has become one of the hot . In the polymer microfluidic chip production process, bonding is its final decision to the use of performance is an important part , is a polymer microfluidic chips from research to application and a key step in mass production . Conventional thermoplastic polymer microfluidic chip bonding methods include direct thermal bonding and interstitial bonding , etc. , but these methods prevalent processing efficiency is low, the bonding strength is not high , it is difficult to achieve mass production and other issues. Ultrasonic welding technology will be applied to the polymer microfluidic chip bonding is a new bonding method , with bonding time is short, high bonding strength , without the introduction of other substances , etc., has achieved a polymer microfluidic chips mass production applications. However, the introduction of this kind of macro- micro technology field , there are many problems . Fusion bonding has the advantages of high bonding strength , but the micro- connector designed to be bonded to a successful bonding of the key. To solve this problem , this paper comprehensive macro plastic specimen welded joint design of the general principles and the silicon process technology based on the two novel micro- bonded joints , using photolithography and anisotropic wet etching technology to produce the corresponding silicon mold , modify the traditional silicon-based process route to solve the multi-layer resist mold coating and lithography difficult problem , implements two silicon mold making micro connector . Produced by hot pressing technique bonding substrates adjusted hot pressing process technology to solve the many problems that exist in hot achieve bonding hot chip production. After ultrasonic bonding tests , analyzes and compares the two bonded micro connector on the polymer microfluidic chip ultrasonic bonding quality effects , obtained ultrasonic bonding microfluidic chip micro connector rational design of several laws , which for future fusion bonding polymer MEMS micro ultrasonic joint design has guiding significance .

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Manufacturing process
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