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Diamond / Cu composites research

Author: DengLiFang
Tutor: ZhuXinKun
School: Kunming University of Science and Technology
Course: Materials Science
Keywords: Diamond / copper composite material Resintering process Hot forging process Hot extrusion process Density Thermal expansion coefficient
CLC: TB333
Type: Master's thesis
Year: 2009
Downloads: 153
Quote: 0
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Abstract


With the rapid development of the information age , the traditional electronic packaging materials can not meet the various electrical components of modern integrated circuits, and the development of electronic packaging requirements. The new packaging material requires lightweight , high thermal conductivity , low thermal expansion performance , diamond / Cu composites reinforced combination of copper and has excellent characteristics of good thermal conductivity and adjustable thermal expansion coefficient has a very broad application prospects . However, current theories of the system is not yet mature and applied research , the urgent need for more exploration and research. In this thesis, powder metallurgy ( resintering process , powder vacuum canning hot forging process and powder vacuum canning hot extrusion process ) Preparation of single-crystal diamond particles reinforced diamond / copper composite material . By XRD, optical microscopy, scanning electron microscopy microstructural characteristics of composites were studied and tested composite thermal expansion coefficient. Forming process focused on studying the density of the composite , and to investigate the thermal expansion coefficient factor. For diamond size 40μm, the volume content of 70 % of the composite material obtained using different preparation process : resintering process of the composite materials sintered at 890 ℃ 8 hours up 82.82% of its density , and its thermal expansion at 50-100 ℃ coefficient of 6.4 ~ 7.5 × 10-6 / K; powder forging process vacuum sheath composite prepared 79.584-80.692 % of its low density , thermal expansion coefficient of 11.315-11.647 × 10-6 / K; powder vacuum bag sets prepared by hot extrusion 40gm, the volume content of 70 % composite density of 70.125% , the thermal expansion coefficient of 7.864 × 10-6 / K. Through the thermal expansion coefficient of factor analysis results : Thermal expansion coefficient with temperature and the increase of the degree of diamond particles increases with the volume fraction of diamond increases. Through the preparation of diamond / Cu composite material for the thermal expansion coefficient of model calculations and found various resulting composite material forming process experimental model were higher than the calculated value of the theoretical model and ROM mixing rule model Calculated Kerner the diamond case of low volume fraction and the measured value is relatively close to the volume content of the diamond increases when the model is less than the calculated measured values ??.

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CLC: > Industrial Technology > General industrial technology > Materials science and engineering > Composite materials > Metal - non-metallic composite materials
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