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Experimental Research on Buckling of Thin Films in Nano-scale Under Mechanical-Thermal Coupling Load and Thermal Fatiguein Research

Author: SunJianQiang
Tutor: WangShiBin
School: Tianjin University
Course: Solid Mechanics
Keywords: Film buckling Thermal stress Axial force Coupled thermo Thermal fatigue
CLC: TB383.1
Type: Master's thesis
Year: 2008
Downloads: 102
Quote: 2
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Abstract


Recent years, along with the extensive application of the coating material, the the foreign scholars deposition film delamination and buckling problems growing concern, mainly because of delamination and buckling major destruction in the form of micro-and nano-electromechanical system devices, the study is to the thickness 500nm thin film materials testing and characterization of the mechanical properties of the force load and thermal load, this research is of great significance for the life prediction. Micro-and nano-electromechanical systems, the substrate film model system more and more. In the application of the the film base model system, the model will be some external force load, usually this system will produce heat, making this binary system at the same time by the thermal load. The deposition of this paper, research and analysis of the discussion in the plexiglass substrate Ti / Ni, Cu, AL film, under the combined effect of the residual stress and the applied axial load and thermal load buckling process. Using an optical microscope observation film surface morphology and its changes under stress, and thermal loads. In order to simulate the film layer is formed in the composite conditions buckling, in the test specimen applied external uniaxial compression load and thermal load. Herein the force load applied by having a self-locking function of the pair of loading unit, and the thermal load is applied through the resistive heating film. This article is only for the mechanical properties of the base film model system in force - thermal coupling field under analysis. As the model system of the film substrate in the micro and nano-electromechanical systems device is often pre-fixed, so conditions at room temperature, are often subject to certain external force load, its heat is generated when the work, so that this system also influenced by the thermal load to which the film substrate . In this test, the thermocouple on the substrate / film temperature measurement, and design of a thermal load applier circuit diagram, able to control the accuracy of the thermal load is applied, the thermal load applied to simulate the operating temperature range of the micro-electromechanical system, The research has practical application value. For the application of the film-substrate system in the micro-electromechanical system, the pre-applied force to load different from the base film in the work produced when the heat temperature is elevated, its buckling size and quantity of the surface of the film are different, and this article described in the test, for a film substrate in different external force load when the temperature increases under buckling qualitatively film substrate force - when working under optimal conditions in the thermal load. Finite element numerical analysis of heat transfer problems in the film - substrate system, system temperature distribution, thermal stress distribution curve with the experimental values ??were verified by comparing the description of the test phenomenon

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