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Robotics Ball Attachment Workcell for Ball Grid Array Semiconductor Packages

Author: FangXing
Tutor: XiaLian
School: Hefei University of Technology
Course: Mechanical and Electronic Engineering
Keywords: Ball Grid Array Automatic bumping machine IC Semiconductor packaging Automatic alignment Image detection
CLC: TN405
Type: Master's thesis
Year: 2005
Downloads: 199
Quote: 3
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Abstract


Functions are becoming more and more sophisticated electronic products , IC package pin count IC size is getting smaller and smaller , gradually unable to meet these requirements using traditional surface mount technology , ball grid array (BGA) package to become the new IC packaging mainstream technology , meet all kinds of needs BGA package chip . The development of packaging technology has brought new challenges to the semiconductor packaging equipment , in BGA chip growing demand , the market is an urgent need to develop a new automated packaging equipment to meet the BGA package requirements . At present, China BGA packaging equipment has only just started , the BGA packages bumping devices based on computer-controlled studies have not been reported . In this paper, a low cost, high efficiency BGA automatic bumping . The main contents include: 1 . Comprehensive detailed discussion of semiconductor BGA packaging technology and development profile , BGA automatic bumping development requirements . Designed STAR - 04Z BGA automatic bumping the general scheme of the principle of vacuum aspiration bumping technology and BGA automatic bumping the system , the structural design of a product prototype , and discusses the impact bumping the quality of key issues. Discusses the use of parametric design ideas in the BGA ball CAD design process . Proposed a common hardware and software -based BGA automatic the bumping machine image detection and accurate positioning system architecture model . Analyze and discuss the results show that the STAR - 04Z BGA automatic bumping the general scheme and prototype designed to meet the functional requirements of the market . The IC BGA packaging technology and equipment for domestic in future and lay a good foundation .

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Manufacturing process
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