About 5 item dissertation in line with Bonding reliability query results,the following is 1 to 50(Search took 0.081 seconds)

  1. CMOSO.5um process and device pad placed under the circuit reliability study,WeiChunNiu/Fudan University,0/22
  2. A Study of Mechanical Property for Nano-Silver Sintered Lap Shear Joint,LiXin/Tianjin University,0/165
  3. Studies on Vibration Propagation and Performance Formation of Thermosonic Flip Chip Bonding Interface,WangFuLiang/Central South University,6/263
  4. A Study of Mechanical Properties for Anisotropic Conductive Adhesive Film and Bonding Reliability for COG Assembly,GaoLiLan/Tianjin University,0/128
  5. Research of Composite Absorbent and Adsorbent Bed Used in Adsorption Refrigeration Driven by Medium Temperature Waste Heat,MengXiangZuo/Zhengzhou University,0/43

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