LED packaging - Dissertation

About 22 item dissertation in line with LED packaging query results,the following is 1 to 50(Search took 0.020 seconds)

And the properties of UV curing silicone encapsulation adhesive preparation LED package,ZhangZhe/Wuyi University,0/113
High Power LED Phosphors Colloidal Packaging Technology Research,WuYiPing/China Jiliang University,0/5
The Study of White Light LED Packaging Technology,ZhangJinHua/Huaqiao University,0/95
Thermal Analysis of High-Power Led Packaging,ChenJianLong/South China University of Technology,0/317
Study on Aluminum Core AlN Thin Film for High Power LED Packaging,YangLi/Zhejiang University,0/476
The Research and Design of Visual System in LED Packaging Equipment Based on IEEE1394,LingXiaoChun/South China University of Technology,1/94
The Silicone Materials Modified with POSS for LED Packaging,YangLinLin/Hangzhou Normal University,0/189
Synthesis of Methyl Vinyl MQ Resin and Reinforcing for LED Packaging,ZhouCanZuo/Jiangnan University,0/412
The Marketing Research of M Company’s Ultra Clear Silicones Elastomer Applied in LED Packaging Field,YangZhu/South China University of Technology,1/161
High-power LED package and its heat dissipation substrate,LiHuaPing/Xi'an Optics and Fine Mechanics,5/3074
Research on Key Issues of Design and Manufacturing for High-Power Light-Emitting Diode Packaging,LiuZongYuan/Huazhong University of Science and Technology,9/2087
The Optical Simulation of Multi-chip LED,ZengZhiPing/Huazhong University of Science and Technology,1/417
Preparation of High-performance Solar and Thermal Composite Materials for Application Research on White LED,CaoMeiLing/East China Normal University,1/323
Design of Radiator for High-power LED Multi-chip Module and Analysis of Packaging Thermal Resistance,YangChuanChao/Harbin Institute of Technology,6/509
Study on Packaging Technology of Uv-led Light Source for Ink Curing Application,LiuHai/Huazhong University of Science and Technology,1/128
Thermal Design of High-Power LED Multi-Chip on Board Package,LiuZuo/Harbin Institute of Technology,0/430
Investigation of a New Technique for Led Die Bonding with Solder Alloy as Thermal Interface Materials,ZongFei/Harbin Institute of Technology,0/91
Study on Water Glass Based Thermally Conduvtive Adhesive for LED Packaging,LiYangLin/Harbin Institute of Technology,0/128
The Development of Addition-Cured Rtv Silicone Rubber Based Insulative Thermal Conductive Adhesive,PanWeiJian/Harbin Institute of Technology,0/114
Study on Water Glass Based Heat Conduvtive Adhesive for High Power LED Packaging,ZhengLianJie/Harbin Institute of Technology,2/229
Influence of Phosphor Settling on Optical Consistency of High-Power LED,FengZuo/Huazhong University of Science and Technology,0/56
Research on High-performance Silicone Resins for LED Packaging,SunYuPing/Suzhou University,1/486