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Bonding wire is one of the five important structural materials of the IC packaging industry , future IC industry high intensity of its small diameter and high performance requirements . The ordinary drawing production process due to low productivity, broken wire problems exist , making it difficult to meet the development requirements of the bonding wire . With the development and maturity of the technology , the hydrostatic extrusion technology not only in the processing of low plasticity , difficult to deformation materials gradually become a reality and that the technical processing of ultrafine wires , U.S. Metalfoming company's technology has matured . This article describes the development of bonding wire and hydrostatic extrusion , through the analysis of the development requirements of the bonding wire and the hydrostatic extrusion process analysis , the use of hydrostatic extrusion method to produce ultra-fine gold bonding wires . In this paper hydrostatic extrusion tooling design , mold design , process characteristics , the pressure characteristics of the special nature of the process , the die angle hydrostatic extrusion pressure , hydrostatic extrusion of lubrication and other related content test . On the basis of theoretical analysis , design and manufacture a set of hydrostatic extrusion tooling , including : extruded tube , extruded rod , base and diamond mold . And use their own design and processing equipment to conduct exploratory squeeze test . The main research results are as follows : 1 , analysis of contrast hydrostatic extrusion and general extrusion force model ; 2 , analysis of theoretical studies of the hydrostatic extrusion media selection , lubrication achieved sealing system design process , in accordance with the the subject of the test conditions to complete the design of tooling and high pressure sealing ; 3, the necessary pilot studies and analysis of the problems encountered in the test , and continuous improvement of the mold structure ; 4 , through the continuous improvement of the test process , a Φ0.38mm of raw materials silk squeezed into Φ0.07mm. Article also of specific phenomena encountered in the test , such as the wire is difficult to collect the first compressed air and then squeeze the extrusion pressure will reduce a more detailed analysis , the direction of the next stage of the test , the test content and the areas for improvement are described . Experimental study of the subject shows that , under our existing technological level , the hydrostatic extrusion of ultrafine wire can be achieved. To this end , this paper presents a complete embodiment of hydrostatic extrusion technology industrialized production of ultra-fine wire .
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