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Development of precision diamond abrasive products

Author: WangSen
Tutor: JiaXiaoLin
School: Zhengzhou University
Course: Materials Science
Keywords: Diamond Surface Modification Polishing liquid Grinding film
CLC: TG580.68
Type: Master's thesis
Year: 2009
Downloads: 58
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Abstract


The ultra-precision machining is a modern cutting-edge production technology industry, which requires not only a high-precision, high quality, and the requirements of low cost and high reproducibility. Ultra-precision polishing and processing equipment, environmental factors do not ask, you can achieve nanometer or even atomic level processing due to the unique processing principles, has become an important part of the ultra-precision machining technology, ultra-precision polishing the key material is precision abrasive products. Diamond powder has high hardness and corrosion resistance and other advantages, the preferred raw material for precision grinding products. In this paper, a lower HLB value of non-ionic surface active agent as a modifier, modified alkane solvent as medium, the graft-modified high-energy ultrasound as a dispersion means on the surface of the nano-diamond. Lipophilicity by the capillary method and viscosity after study of modified nano-diamond powder by infrared spectroscopy (FTIR) and thermal analysis of the effect of the the research modifier in powder surface adsorption. The results show that: the wet modification of nano-diamond surface, Span-60 can be modified Hou Nami diamond surface from hydrophilic to lipophilic. The modifier in the surface of the nano-diamond occurred chemical adsorption, better dispersibility of it in an organic solvent. The modified nano diamond powder as an abrasive, selected from the several light oil suitable dispersing medium, and adding a surfactant made of nano diamond as an oil solution, an ultrasonic dispersion and then centrifuged. The type of dispersant and its dosage, ultrasonic time, the centrifugal speed and time performance of the polishing liquid, and the the polishing liquid dispersion, oxidation resistance and polishing performance characterized. The results show that: the white oil as a polishing liquid dispersion medium is more appropriate; Preferably, the complex with the dispersing effect of the DBS and PEG; 150W ultrasound 20min, the settlement of the suspension tends to minimum; the 2500r/min centrifugation after 30min, polishing The liquid secondary particle size tends minimum; monocrystalline silicon wafers polished surface roughness 0.306nm. Modified monocrystalline diamond powder and resin gum are blended, a slurry, a casting tape coated on a polyester film base, made of a precision diamond polishing film after drying and curing. Studied the factors that affect the performance of the slurry, the height of the blade of the casting machine, the height of the surface of the feed slurry, the casting speed, the drying temperature and the viscosity of the slurry and the solids content of the abrasive impact on the quality of the polishing film, and polishing film characterized. The results show that: the rheological agent fumed silica added in an amount of 1.8%, the shear rate of 10s -1 viscosity of the slurry when 190mPa.s to 260mPa.s; planetary mill 600 rpm / min grinding tends to the minimum of 30 minutes after the settlement of the slurry; increasingly evident as the abrasive particle size decreases Benard dry film surface eddy; slurry viscosity reduced from 25s to 15s (Tu 4 cup) dry film surface of the flow marks disappear; increase with abrasive content, an increase in the grinding ratio of the polishing film, the tensile strength decreases.

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CLC: > Industrial Technology > Metallurgy and Metal Craft > Metal cutting and machine tools > Grinding and grinding machine > General issues > Grinding process > Grinding
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