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Analytical and Simulation Study on Thermal Contact Resistance of Solid Interfaces at Low Temperature

Author: WangLiPing
Tutor: ChenHuanXin
School: Huazhong University of Science and Technology
Course: Refrigeration and Cryogenic Engineering
Keywords: Solid contact interfacial thermal resistance Regression analysis Model Simulation Laser Photothermal Hot carrier transfer
CLC: TK124
Type: Master's thesis
Year: 2009
Downloads: 57
Quote: 0
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Abstract


Solid contact interface heat transport microscale heat transfer cutting-edge content , but also superconducting applications , space thermal control , micro-electromechanical systems (MEMS) and nanodevices cooling and other areas of the urgent need to solve the key scientific issues . Solid contact interfacial thermal resistance , the use of regression analysis , the model simulation , theoretical analysis and other methods study to explore the microscopic mechanism of the interfacial thermal resistance of solid contact . Experimental principle and use of laser light and heat conditions on the basis of the research group pre- experimental study , further research designed 20K-300K Copper - the contact interfacial thermal resistance of aluminum nitride laser photothermal experimental systems and devices . Copper - stainless steel , copper - aluminum and copper - copper contact interface thermal resistance based on the correlation of experimental data , regression analysis and model simulation . Simulation results show that the solid contact interface thermal resistance decreases as the temperature rises sharply at first decreases and then increases gradually with increasing pressure gradually decreases ; temperature and pressure on the interfacial thermal resistance of the solid-contact coupling exists . Is based on the concept of micro- thickness ( nanometer ) level three-dimensional microstructures contact interface layer solid contact interface thermal resistance model based on the phonon transmission discussed ; Considering pass electrons, phonons and electron - phonon coupling , solid contact interface heat carrier thermal resistance model . Due to the complexity and uncertainty of the interfacial thermal resistance of the solid contact , solid contact interface heat transport mechanism of the urgent need for further in-depth study , in order to get the perfect reveal and clarify .

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CLC: > Industrial Technology > Energy and Power Engineering > Thermal engineering, heat > Thermal Engineering Theory > Heat Transfer
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