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Research on Photovoltaic Poly-Silicon Films in Multi-wireCutting Mechanism and Technology

Author: TaoDaQing
Tutor: YangXingLin
School: Jiangsu University of Science and Technology
Course: Mechanical and Electronic Engineering
Keywords: poly-silicon wafer multi-wire cutting mechanism simulation of finite elementanalysis design of experiment analysis of data processing of machining
CLC: TN305
Type: Master's thesis
Year: 2013
Downloads: 4
Quote: 0
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Abstract


With industry and the technology developing，make the energy demand is increasing,therefore, the photovoltaic industry as a kind of green and renewable energy industry isbooming, and as the photovoltaic industry the main technological process of silicon wafercutting becomes more and more important，in the poly-silicon wafer in the processingprocess, how is cutting mechanism, and the processing mechanism of change is how toinfluence the poly-silicon wafer process, how to ensure that the entire process of thereliability and safety, and how to ensure the quality of photovoltaic poly-silicon wafer.Based on the above reasons, the analysis and optimization is imperative.In this paper，the photovoltaic poly-silicon wafer wire cutting system is the study object,elaborated the photovoltaic poly-silicon wafer cutting machine management based on there-use of ANSYS/LS-DYNA to simulate the machining process, the last related photovoltaicpoly-silicon wafer cutting experiments and analysis experimental data, in order to determinethe best multi-wire photovoltaic poly-silicon wafer cutting process. The main content of thispaper include photovoltaic poly-silicon wafer multi-wire cutting management, multi-wirecutting the establishment and analysis of the finite element model of photovoltaicpoly-silicon wafer, photovoltaic poly-silicon wafer wire cutting system is the main factor todetermine the impact and experimental verification, analysis of photovoltaic poly-siliconwafer the multi-wire cutting system of experimental data as well as determine thephotovoltaic poly-silicon wafer multi-wire cutting system process.This article focuses on the multi-wire cutting management aspects of photovoltaicpoly-silicon wafer study based on the mechanism of brittle materials processing, andanalysis the single cutting media processing poly-silicon material crushing and processing,in order to analyze the mechanism of multi-wire cutting processing, and finally elaboratemulti-line cutting process types and causes of failure.In photovoltaic poly-silicon wafer multi-wire cutting simulation, this paper focuses onusing the ANSYS/LS-DYNA software simulation of photovoltaic poly-silicon wafermulti-wire cutting process. In the model to the simulation process, this paper mainlydiscusses the influence of different processing conditions and compares the simulationmaterial. Comparison found the two emulation materials have their own advantages anddisadvantages, but different processing conditions influenced the quality of photovoltaic poly-silicon wafer.Photovoltaic poly-silicon wafer wire cutting experiments to first determine the impact ofphotovoltaic poly-silicon wafer multi-wire cutting six main factors, and then select one ofthe two main factors for design of experiment, and at last, according to the experimentalrequirements before the experiment and collate experimental data.The cutting process in the photovoltaic poly-silicon wafers multi-wire, this article focuseson using the JMP statistical software for the analysis of experimental data results forecastphotovoltaic poly-silicon wafer wire cutting process, according to the analysis results, andthen the best forecast of the processing parameters for experimental verification, finalizedon the basis of the best photovoltaic poly-silicon wafer processing.

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Semiconductor technology > General issues > The semiconductor device manufacturing process and equipment
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