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Preparation and Study on Monocomponent Heat-resistant Epoxy/Guanidinium Structural Adhesives

Author: ZhangNa
Tutor: TanMeiJun；WangZhengXiang
School: Hunan University
Course: Materials Science
Keywords: monocomponent phenolic epoxy resin guanidinium butyl rubber structure adhesive
CLC: TQ433.437
Type: Master's thesis
Year: 2011
Downloads: 81
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Abstract


Epoxy resin possessed best bonding strength , comprehensive performance and low shrinkage. Its heat-resistance and toughness were not high enough. It became the first choice of heat-resistance structure adhesive materials with excellent performance after many ways of modification. The epoxy’s toughness and heat-resistance were modified on structure, and a high activity of guanidinium curing agent was synthesized, and a kind of monocomponent heat-resistance epoxy structure adhesive was prepared in the article. Its performances have been significantly improved compared to traditional dicyandiamide/EP system. Main research contents were as follows:(1) Preparation of a high-efficient latent curing agent. A kind of Salt-methyl-phenyl biguanide was synthesized with the reaction between Toluidine and dicyandiamide. The curing system of Salt-methyl-phenyl biguanide/E-51 was analyzed by DSC and FT-IR at room temperature with different storage periods. And the results showed that: the initial curing temperature of Salt-methyl-phenyl biguanide was 74℃lower than Dicyandiamide. And its storage period could reach 180d at room temperature.(2) Epoxy resins was toughened with ETBN The results showed that: When EP:ETBN=20:3(wt), mixed up evenly for 20 minutes under 80℃, and solidified one hour under 130℃with Salt-methyl-phenyl biguanide. The shear strength could reach 24.27MPa and peel strength reach 46.06kN/m at room temperature with good medium-resistant performance. SEM showed that: The Salt-methyl-phenyl biguanide/EP/ETBN system curing created split phase, rubber phase evenly dispersed in the EP matrix, and the effect of ETBN toughening EP was obvious.(3) With hydrochloric acid as the catalyst, A kind of heat-resistant phenolic epoxy resin was synthesized by two-step. Its softening point could reach 150.3℃. The optimal synthesis conditions were:(a)Aldehydes/phenol Moore ratio was 0.84, The initial reaction temperature was 60~70℃, then heated up to 90℃; (b) Epoxidation of phenolic resin was to add epichlorohydrin at lower than 60℃in the first, then the sodium hydroxide solution was dropped at 90℃. Added sodium hydroxide solution for three times: adding 1/2 volume for the first, then adding the remaining amount in twice.(4) Two types of structural adhesive were prepared by EP and phenolic epoxy resin. The results showed that: Both ETBN and Salt-methyl-phenyl biguanide had obvious modification effects on two resins. The performance of structure adhesive prepared by phenolic epoxy resin was better than EP blended with phenolic resin. (Shear strength achieved 25.12MPa, and T peel strength achieved 50kN/m; The Initial weight loss temperature was at 400℃, and the weight decomposed about 80% at 500℃); And its storage period could reach three months at room temperature.

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CLC: > Industrial Technology > Chemical Industry > Adhesive Industry > Synthetic adhesive > Rubber, resin as raw material adhesive > Synthetic resin adhesive of the raw materials > Epoxy adhesive
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