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The tungsten copper heat sink material prepared new technology research

Author: ZhangQiWang
Tutor: WangZhiFa
School: Central South University
Course: Materials Physics and Chemistry
Keywords: High velocity compaction Tungsten and copper materials Hot forging Induced copper Thermal conductivity Densification
CLC: TN04
Type: Master's thesis
Year: 2010
Downloads: 135
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Abstract

W-Cu electronic packaging material has excellent thermal conductivity and thermal expansion coefficient , adjustable electronic packaging materials are preferred by the domestic and foreign military electronic components , especially the solid-state phased array radar . The performance of the W-Cu electronic packaging materials developed by the Institute of Central South University, electronic packaging materials close to the international level of similar products . But with the variety of parts of the W-Cu electronic packaging materials , more and more increasingly high performance requirements specifications , the original production technology and equipment in the mass production process revealed some new problems , mainly in : static the pressure molding limitations ; surface holes ; phenomena of black spots after plating . This study , including the use of high velocity compaction technology to improve the relative density of tungsten billet , hot forging process improvement to the density of tungsten copper material , add induced copper melt infiltrated improved tungsten skeleton hand , analysis of the causes of the above problems , and by means of scanning electron microscopy the morphology of the material was observed , the results showed that: (1) at room temperature , 600 ° C and 950 ℃ tungsten preforms for high-speed repression green density increases with increasing compaction temperature . With the increase in the number of high velocity compaction , the green density is also improved. (2) mixing tungsten powder at 950 ℃ using high - speed pressing techniques , can be obtained relative density is 80.65% of the W skeleton , combined with the melt infiltration process to meet the requirements of the W90-Cu material , reached 99.5% , the relative density , thermal conductivity of 175W, / (m · K), air tightness and thermal expansion coefficient , and other indicators have reached the performance requirements of the appropriate heat sink material . (3) at room temperature , 450 ° C , 650 ° C and 950 ℃ of tungsten - copper alloy forging enhance largest Preferably , the degree of densification , tungsten, copper alloy , the maximum amount of deformation of a tungsten - copper alloy 950 ° C hot forging , the density of the most appropriate forging temperature of 950 ° C . (4) adding 3% induction of copper powder particle size of 2.4μm tungsten powder can be achieved more than 72.46% of the 950 ° C high velocity compaction , the relative density of the tungsten skeleton infiltrated after of W85-Cu alloy the thermal conductivity rate of 186 W / ( m · K), the air tightness of 1 × 10-9Pa · m3s-1, the relative density was 98.5% .

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