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Nano-Cutting Surface Quality for Single Crystal Silicon and Molecular Dynamics Simulation

Author: QiYanYong
Tutor: LiangYingChun
School: Harbin Institute of Technology
Course: Mechanical Manufacturing and Automation
Keywords: Nanometric cutting Surface quality Molecular Dynamics Simulation
CLC: TG501
Type: Master's thesis
Year: 2008
Downloads: 65
Quote: 1
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Abstract


The ultra-precision nanofabrication technology is the forefront of modern mechanical manufacturing technology , machining accuracy approaching nanometer scale , nanofabrication research on the mechanism of the development of ultra-precision nanofabrication technology . With the development of MEMS and NEMS systems , parts and components tends to miniaturization , sometimes even to the nanometer scale , surface morphology will become one of the most important factors affecting performance parts , the workpiece to be machined is no longer continuous solid , continuum mechanics based on the traditional cutting theory to explain the mechanism of nanofabrication and processing the surface of the formation process is clearly inappropriate . This paper presents different conditions multiple passes molecular dynamics simulation method , the nanofabrication mechanism by means of molecular dynamics simulation of brittle materials , prepared nanometric cutting simulation program . For a comprehensive understanding of the mechanism of nanofabrication has theoretical significance and practical value , but also for the further development of ultra-precision nanofabrication technology to provide the necessary theoretical basis . Single monocrystalline silicon nano cutting process of three-dimensional molecular dynamics simulation model , monocrystalline silicon material processing conditions in different paths , different depths , different intervals , different tool shapes , different tool angles , different tool size and repeatedly take the knife process simulation . Has been the basic law of the number of passes on the workpiece surface quality and relatively complex processing conditions rake angle , tool shape and the size of the surface quality , is proposed for the single crystal silicon material processing the spherical tool than the rectangle tool more suitable for many of the same surface cutting conclusions are theoretically significant , the actual process .

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CLC: > Industrial Technology > Metallurgy and Metal Craft > Metal cutting and machine tools > General issues > Cutting principle and calculation
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