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Study on Arc Ion Plating with Magnetron of Same Basic Component for Both Deposited Layer and the Substrate (QTi2.5／Cu)

Author: HaoJunLi
Tutor: YuanQingLong；HouWenYi
School: Taiyuan University of Technology
Course: Materials Processing Engineering
Keywords: Pure copper Cu-Ti alloy (QTi2.5) With the base Magnetron Arc ion plating Coating microstructure and properties
CLC: TG174.444
Type: Master's thesis
Year: 2009
Downloads: 7
Quote: 0
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Abstract


With the base alloy by arc ion plating technique in recent years, the development of a new surface deposition method. Preliminary work is to study non-magnetron, plus magnetron conditions arc on 45 steel, pure copper matrix deposition coating 1Cr18Ni9Ti QAl9-4, was a success. And then again 45 steel substrate deposition 2Cr13, H62 preliminary exploration and research in pure copper matrix deposition. To further investigate the mechanism of this research project magnetron conditions in pure copper surface QTi2.5 bronze plating process, plating chemical composition and composition distribution, plating organizations microhardness distribution, bond strength and resistance of the coating and substrate wear, corrosion resistance, etc. Alloy magnetron arc ion plating experiments QTi2.5/Cu same group results show that the coating is mainly composed of two parts: the buffer layer (pseudo-diffusion layer true diffusion layer), and the deposited layer, coating tissue: plus Magnetron conditions under dense. Exist the reverse sputtering mix and composition elements interdiffused a buffer layer formed at the bonding interface, so that the coating and the substrate has a good combination of strength. Magnetron conditions plus plating chemical composition of the coating and plating material is basically the same, but the ingredients gradient distribution by the table to where there are differences - Ti content of the sediment layer, the surface Ti content is slightly higher than the target Ti content, which is due to the sputtering of Cu, TI the different coefficients. XRD results show that the Organization of QTi2.5/Cu coating is mainly composed of α-solid solution phase composition, not found Cu4Ti phase, may be its amount is too low, not enough to appear visible diffraction peaks. The strengthening of the coating is mainly due to the solid solution strengthening effect of Ti. The deposition rate and the process parameters related to the arc current increases, the sample and a target surface, the shorter the distance, the higher the deposition rate. And the arc current has a greater impact on the coating grain size, thinner coating grains smaller arc current, the arc current is larger plating coarse grains. The Microhardness and coatings wear experimental results show that the pure copper by Shi After plating QTi2.5, the surface hardness, wear resistance is improved. Electrochemical methods (three-electrode system, the electrochemical impedance spectroscopy (EIS)) were measured concentration 0.5mol / L HCl and 5% NaCl solution corrosive QTi2.5/Cu coating with pure copper phase. than self-corrosion potential of the positive shift of the corrosion current density, corrosion rate decreased, indicating increased corrosion resistance. Plasma surface alloying modified layer compared, QTi2.5/Cu with the base alloy magnetron ion plating all effectively modified layer. Different to the infiltration of metal workpiece without the overall heating, only the surface of the workpiece by the role of high-temperature stream of particles of the instant of the topsheet higher temperature and lower overall temperature workpiece, which workpiece small distortion. And the composition of the plating plating material composition can be adjusted to control. Compared with heterogeneous alloy ion plating, plating material and substrate elements QTi2.5/Cu with the base alloy ion plating (highest concentrations), plated material substrate on physical performance parameters differences smaller coating thickness range can be greatly relaxed. Exploration and Research of the topics for the energy, materials, clean inject new vitality into the development of the ion surface modification technology known.

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CLC: > Industrial Technology > Metallurgy and Metal Craft > Metallurgy and Heat Treatment > Metal corrosion protection,metal surface treatment > Corrosion control and protection > Metal surface protection technology > Metal complex layer of protection > Vacuum plating and vapor deposition method.
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