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Epoxy resin having a small shrinkage in the curing reaction, the cured adhesion, heat resistance, chemical resistance and mechanical properties, excellent electrical properties and other characteristics, is of a species of the thermosetting resin in a larger amount of applied play an important role in the electronic, electrical, machinery manufacturing, chemical preservative, aerospace, shipping transportation and many other industrial sectors, widely used as a bonding agent, corrosion-resistant coatings, construction materials, electrical insulating materials, composite matrix material, has become the indispensable basis of materials in various industrial fields. However, due to high crosslink density in the epoxy resin after curing, the existence of internal stress, crisp, fatigue resistance, impact properties and poor insufficient, especially in recent years, with the advances in the field of electronic and electrical technology originally fairly excellent resistance heat, gradually seems inadequate. How to improve the heat resistance of the epoxy resin has aroused the interest of many researchers. The polymer / inorganic nanocomposite materials to overcome the defects in a single material and a conventional composite material properties, so that the material has both the advantages of inorganic material, and at the same time having the advantages of the polymer material, has been a material hot area of ??research. Silica nanoparticles advantages by virtue of its high thermal stability, rigidity and modulus, is the first for the preparation of organic / inorganic nanocomposites inorganics one, it added can improve the thermal stability and mechanical properties of the polymer . Based on these studies the background and development requirements, the papers use epoxy / silica nano-composite studied different forms of silica on the heat resistance of epoxy: (1) water glass Precursor silica sol, and an epoxy resin formed organic-inorganic interpenetrating network. And the thermal properties of the composites were characterized. (2) a method of salting-out extraction organosilica sol particles obtained by the direct method of mixing a good dispersion of the composite material, and investigated the influence on the thermal properties of the epoxy resin in the presence of the silica particle morphology . (3) 3 - glycidoxypropyl trimethoxy silane as the precursor, preparation of the silica / epoxy hybrid materials investigated silica dispersed in epoxy resin with excimer level when the epoxy thermal performance. Overcome by improving the preparation of the precursor and hybrid materials full hybrid materials prepared by the method of condensation problems, positive sense of the material on the CCL. (4) In the silica / hybrid material as the substrate, prepared CCL and to test the heat resistance, resistance to soldering, water-absorbent, thermal stability, and thermal mechanical properties are obtained high heat CCL material, its heat resistance up to 230 ° C.
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