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Moisture Absorption Property of Material and Moisture&Thermal Affects on Package’s Reliability

Author: JiangHaiHua
Tutor: LengXueSong
School: Guilin University of Electronic Science and Technology
Course: Mechanical and Electronic Engineering
Keywords: System in Package Moisture diffusion Hot and humid synthetic stress Cohesive zone model Delamination failure
CLC: TN304
Type: Master's thesis
Year: 2009
Downloads: 94
Quote: 0
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Abstract


Hot, wet surroundings factors cause delamination cracking failure, is one of the main failure mode of the microelectronics packaging device. The encapsulated device reliability problems in the wet, hot load conditions has been a research focus of the microelectronics industry. The topics are mainly derived from the mentor of the project in the Netherlands \In this paper according to the requirements of the project, more promising QFN Package SiP devices (abbreviated as: SQFN), for its failure in the wet, the moisture diffusion in the thermal environment, the synthesis of stress and delamination cracking The other aspects of the problem has been studied. The main contents include: 1, moisture diffusion parameters based on material obtained by the experiment, the moisture absorption behavior of the packaged device simulation, comparative analysis and the the packaged devices absorbent experimental weight change, identification and verification of materials under different temperature and humidity material parameters. And this material parameters are extended to the desorption behavior. Moisture diffusion, damp heat stress calculations to prepare for the back of the device. Established SQFN package devices parameterized 3D finite element model of the packaged device under different moisture and temperature environment moisture diffusion and analytic the attached behavior of the finite element simulation. Combination of wet, thermo-mechanical stresses, further simulation analysis of the hot and humid synthetic stress SQFN devices during thermal cycling. And the results compared to simply consider the thermo-mechanical stress. 3, based on the method of the cohesive zone model (CZM), delamination cracking failure case SQFN device under thermal cycling conditions. Finite element simulations of various SQFN device interface, thus determined are prone to delamination cracking failure interface. The delamination cracking capacity for the purpose of this interface to improve the packaged device, using CZM analysis method, delamination cracking affect device failure Preliminary sensitivity of structural parameters. Has been a method to improve the resistance to delamination cracking ability of the device. The results show that: (1) by obtaining a molded seal material, underfill and the chip adhesive material absorbent desorption saturated absorbent volume and moisture diffusion rate. The application of these material parameters of the device simulation, simulation results well with experimental results consistent moisture diffusion and desorption. (2) Since the device's internal chip adhesive SQFN, the underfill and molded sealing material there are more moisture absorbent diffusion and desorption process, and is formed in the internal high distribution gradient, such that, under the same conditions The damp heat synthetic Stress is generally higher than the thermal - mechanical stress considered separately. Therefore to dry measures should be taken to the processing and preservation process. (3) simulation, the upper and lower interface chip adhesive delamination the failure parameter the Damage values ??far higher than the top and bottom of underfill interface, and are located at both ends of the interface, due to the the copper pads Diepad chip adhesive sticky The bonding strength is lower than the adhesive strength of the chip and the chip adhesive, so in the chip adhesive Diepad between both ends of the interface are more prone to delamination cracking failure. This spall location consistent with experimental observations, therefore good proof the correctness of the simulation. (4) through the structural parameters of the study device the the impact delamination failure that, increase in the thickness of the copper pads Diepad improve SQFN packaged devices can be very effective resistance to delamination ability, thereby enhancing the reliability of the device, and for the design of high reliability SQFN devices provide a good reference views. Thesis research, researchers in-depth understanding of the moisture diffusion behavior, hot and humid the synthetic stress as well as further research delamination cracking failure has better guidance.

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