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Research on Ti-Zr-Cu-B Amorphous Brazing Filler Metal for Brazing Si3N4 Ceramics

Author: WangChengLong
Tutor: ZouJiaSheng
School: Jiangsu University of Science and Technology
Course: Materials Processing Engineering
Keywords: Ti-Zr-Cu-B Amorphous brazing Si3N4 ceramics Brazing process Interface structure Connection strength
CLC: TG454
Type: Master's thesis
Year: 2010
Downloads: 82
Quote: 1
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Abstract


Si3N4 ceramic active brazing design add trace B elements CuTi30Zr25B0.2 CuTi35Zr25B0.2 CuTi40Zr25B0.2 three kinds of solder , single roller rapid solidification device successfully prepared the foil strip quench solder ; microscopic analysis by means of DTA, XRD , and EDS melting characteristics , structure and composition distribution ; brazing using prepared amorphous Si3N4 ceramic solder connection to study the nature of the process , the joint mechanical properties and crystal with the same composition state comparative analysis of solder ; using SEM, EDS and other means of microscopic analysis , conducted in-depth research interfacial microstructure on the mechanical properties of the joints , the interfacial reaction and the reaction layer . The test results show that : compared with the same composition as the crystalline state of the solder , the above three quench the liquid solder solidus temperature is decreased , and the liquid-solid temperature range is narrowed , and its structure are amorphous ; solder activity the elements Ti content and brazing process parameters all affected the Si3N4 ceramic solder wettability and joint strength , its impact is reflected by the interfacial reaction and reaction layer structure , thickness . Under the same test conditions , the amorphous solder in the Si3N4 ceramic wettability and joint strength were significantly greater than the same ingredients crystalline solder ; using CuTi40Zr25B0.2 amorphous brazing alloy 1323K the test within the scope of this article , brazing temperature , 30min brazing holding time and the pressure on the joint 0.012MPa process parameters , the connector having a connection strength of the best room temperature , up to 191.5MPa ; brazing material of the Ti-Zr-Cu-B , the activity of Ti element than Zr, the first and Si3N4 interface reaction ; Si3N4 ceramics CuTi40Zr25B0.2 amorphous brazing joint interface reaction layer is composed of two parts , close to the ceramic side of the TiN layer , and the rest is the Zr-Si and Ti- Si compound layer ; CuTi40Zr25B0.2 amorphous brazing Si3N4 ceramic joints high temperature strength reaches a maximum at the test temperature 473K , the for 165.5MPa ; test temperature at 573K , the high-temperature strength , when the test temperature greater than 673K The joint strength is sharply reduced.

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CLC: > Industrial Technology > Metallurgy and Metal Craft > Welding, metal cutting and metal bonding > Welding process > Brazing
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