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Study on Defect Inspection of Flip Chip Based on Ultrasonic Excitation

Author: ZhangXueKun
Tutor: LiaoGuangLan；ShiTieLin
School: Huazhong University of Science and Technology
Course: Mechanical and Electronic Engineering
Keywords: Defect detection Flip Chip Natural frequency Vibration velocity Air-coupled ultrasonic excitation
CLC: TN407
Type: Master's thesis
Year: 2011
Downloads: 16
Quote: 0
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Abstract


Flip-chip (FC) defects are often hidden inside the chip , and has brought great difficulties to the defect detection . Vibration model from the FC chip on the chip defect detection principle , the natural frequency based ultrasonic excitation chip and solder joint vibration speed detection technology . The main content of this paper include : 1 . Simplify solder joint quality tensile springs derived the FC chip vibration model natural vibration equation . The theory suggests that the natural frequency becomes smaller chip defective solder joints , defective solder joint vibration speed increase . 2 based air-coupled ultrasonic excitation the FC chip defect detection method by air-coupled ultrasonic excitation chip using the laser vibrometer measured vibration signal to diagnose solder joint defects . 3 calculation , simulation and measuring the natural frequency of FC chip , studies show that the more the number of chips missing solder joints , the smaller the natural frequency . Chip peripheral type FC , ??if the the 3-5 first natural frequency rate of change is greater than 9% , the presence of solder joints missing ; For area array FC -type chip , the first 7 - order natural frequency sensitive missing the corners and the surrounding solder joints can be used for coarse positioning solder deletion region . The simulation and measurement pads vibration speed , research shows that the vibration speed of the defective solder joint is larger than a reference solder , the deviation coefficient of the vibration velocity than the defect-free solder large . FC chip of the peripheral type , if the speed deviation of the measured solder vibration coefficient greater than 0.45 , then there is solder deletion ; FC chip of the surface formation , if the the measured solder vibration speed deviation coefficient is less than 0.3 , there is no defect , if the vibration velocity deviation coefficient greater than 0.35 , then there is solder deletion . Moreover, the method can also locate a defective solder joint . Therefore , the FC chip defect detection method based air-coupled ultrasonic excitation , effectively measured chip natural frequencies and the solder joints vibration speed , then detected FC chip defects .

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Testing and inspection
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