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Real Time Dispatching System in Assembly Test Manufacturing

Author: WuZuoJun
Tutor: PanLi
School: Shanghai Jiaotong University
Course: Electronics and Communication Engineering
Keywords: ATM Rule Dispatch RTD
CLC: TN305.94
Type: Master's thesis
Year: 2011
Downloads: 27
Quote: 0
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Abstract


As the most complicated manufacturing system recognized world-wide, the semiconductor manufacturing system features a large number of tool groups, long production cycles and reentrance and does not fall into either of the traditional Flow-shop or Job-shop system. As part of semiconductor manufacturing process, Assembly Test Manufacturing (ATM) weighs higher in gross semiconductor industrial production and plays more important role in integrated circuit manufacturing than ever before. Therefore, managing and optimizing of ATM system has attracted huge attention from researchers and scientists in practical arenas.With intensifying competition of global market share, the company adopt enlarge capacity and mixed-products manufacturing model in order to fulfill different customer requirements, which leads production scheduling and dispatching difficult. It is critical to improve self-capability and meet customer’s rigorous requirements. This paper introduces a rule-based real-time dispatching (RTD) system solution from manufacture management. The system provides operator guidelines when operator feel lost on how to choose and run correct lots from thousands lots.The system develops based on RTD and .NET. It uses .NET for user interface and RTD for the core of dispatching rule, which ensure system flexibility and real-time data feeding. System delivers simple and clear top-down dispatching list with transferring requirement of on time delivery for order, utilization of critical module maximization and WIP balance. The statistics conveys improving production indicator and simplifying dispatching operation with system deployment, which contributes customer satisfaction rate and company competency.

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CLC: > Industrial Technology > Radio electronics, telecommunications technology > Semiconductor technology > General issues > The semiconductor device manufacturing process and equipment > Packaging and cooling issues
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