Dissertation > Excellent graduate degree dissertation topics show
Research on Fiber Coupled Pump Module of Conduction Heat Sink Laser Diode Theoretically and Experimentally
Author: PangXiaoLin
Tutor: WangZhiYong
School: Beijing University of Technology
Course: Optical Engineering
Keywords: Pump source Fiber-coupled semiconductor laser Package Far-field characteristics Fiber bending
CLC: TN248
Type: Master's thesis
Year: 2011
Downloads: 65
Quote: 0
Read: Download Dissertation
Abstract
|
Its excellent beam quality, the oversized optical power density, high conversion efficiency, small size, compact structure, easy modulation, easy-to-use and freedom from maintenance and other significant features of high-power fiber lasers, has gradually replaced the solid and gas lasers are widely used in in areas such as military, industrial processing, medical and space communications. However, this technology in the future whether greater application development space, but is limited by the compact structure, low-cost, high-brightness and high-stability fiber-coupled semiconductor laser pump source technology development. In this paper, the application of high power fiber lasers and fiber-coupled semiconductor laser in the field of laser processing and its military background, fiber-coupled diode laser pump source module as the main object of study, in order to improve the fiber-coupled diode laser pump source module The high brightness output brightness as the main purpose of the research on the basis of domestic and international technology roadmap, to take the conduction heat sink package semiconductor laser array fiber-coupled fiber-coupled diode laser pump source module. In order to reduce the cost of fiber-coupled diode laser pump source module, a large number of experimental studies of high-power semiconductor laser array packaging technology, summarize the key technical issues of high-power semiconductor laser array package, and a brief introduction of the packaging process, the last of The laser parameters are independent package testing. Parametric test analysis by the fast and slow axis collimation of high power semiconductor laser diode array far-field characteristics, and laid the foundation for the subsequent beam shaping system and the focus of the design and processing of the coupled system. This paper describes the characterization of laser beam quality standard beam focusing characteristics of parameter values ??and one-dimensional semiconductor laser array beam parameter product BPP expression in fast and slow axis direction. The theoretical and experimental studies of conduction heat sink package semiconductor laser array optical fiber coupling method. According to theoretical calculations, this program may be a semiconductor laser coupled into a numerical aperture of 0.22, the optical fiber core diameter of 200μm; finally obtained through experimental study, the coupling into a numerical aperture of 0.22, the core diameter of 600μm fiber, the output power 160.5W (rectangular prism and beam The shaping system uncoated), the coupling efficiency of 74%, plug efficiency up to 42.5%. Also analyzed the reasons for large deviations theory and experiment, and to provide guidance for the subsequent further experiments. Finally, the output of the semiconductor laser of the optical fiber coupler Experimental Study of the wound fiber, and combined light theoretical analysis of the light transmission characteristics of the cladding layer in the curved fiber model, drawn together determine the transmission efficiency of the bent optical fiber by the bending radius and the bent optical fiber length conclusion at the same time easy way around the fiber screening fiber coupled semiconductor laser beam quality.
|
Related Dissertations
- Study on the Application of Exposed-aggregate Cement Concrete in Inner Mongolia Highway Engineering,U414
- The Design and Implemention about the Support System of CTT Voice Package,F626
- Streaming media in a reliable multicast environment Applied Research,TN919.8
- Design and Implementation of Several Modules in the Package Analysis and Management System for Hebei Mobile,TP311.52
- Luoyang Branch of China Unicom Optimization of converged services,F626
- A Study on Green Logistics of Dangshan Crisp Pears,F326.13
- Development of Electrical Power System Simulation Software Tool,TM743
- Study on Enzymatic Browning and Quality Control Techniques of Fresh-cut Apples,S661.1
- Manipulation of Spin Transport Graphene Nanoribbons by Atomic Chains Adsorption,O613.71
- The Research on the Application of Reverse Auction in Procurement Management,F724.59;F224
- The package cache IPQAM Design and Implementation,TP333
- Design of Reciprocating Nature Gas Compressor Package,TH45
- Converter active integrated packaging technology research and optimization,TN405
- The electric system in package analysis,TN405
- Feature Selection for Texture Image Classification,TP391.41
- The Technique and Application of Webservice Encapsulation and Integration Based on ICES-SSP,TP393.09
- Astudy of Interactive Packing Design,J524.2
- Adipose Tissue Inflammation and Expression of Lipid Droplet Associated Protein in Rat with Chronic Renal Failure,R692.5
- Develop the High Acceleration Precision Motion Platform,TH703
- The City Television localization Status and Future Development,G229.24-F
- Portable UV Blocker Packaging Design,TB482
CLC: > Industrial Technology > Radio electronics, telecommunications technology > Photonics technology,laser technology > Laser technology, the maser > Laser
© 2012 www.DissertationTopic.Net Mobile
|