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The reliability of packaging components, directly affects the performance of components. With the rapid development of science and technology, the volume of products with the demand direction to the small chip integration of also rising, along with components of the package size has become smaller, components change the conditions of use The increasingly harsh, the reliability of the package becomes more important.This research work with the software,aggregate product data,statistical data,and charting the ratio of the failure data. This thesis focused on plastic packaging, research the following questions:1., Analysis of plastic reliability problems by thermal shock test, constant temperature and humidity testing, pressure cooker test.2. Plastic package reliability failure of the main phenomena, mainly in SOT-23, TO-126, TO-252 packages are described mainly.3. The main limitation of packaging solutions and the corresponding summary.This paper encapsulates the main issues of classification, through targeted reliability testing, use software statistical analysis and propose solutions, to enhance the production of components, yield and reliability, is of great significance.
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